74AUP2G125DC-G NXP Semiconductors, 74AUP2G125DC-G Datasheet
74AUP2G125DC-G
Specifications of 74AUP2G125DC-G
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74AUP2G125DC-G Summary of contents
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Low-power dual buffer/line driver; 3-state Rev. 10 — 8 February 2013 1. General description The 74AUP2G125 provides the dual non-inverting buffer/line driver with 3-state output. The 3-state output is controlled by the output enable input (nOE). A HIGH level ...
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... Marking Table 2. Marking codes Type number 74AUP2G125DC 74AUP2G125GT 74AUP2G125GF 74AUP2G125GD 74AUP2G125GM 74AUP2G125GN 74AUP2G125GS [1] The pin 1 indicator is located on the lower left corner of the device, below the marking code. 5. Functional diagram ...
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... NXP Semiconductors Fig 3. Logic diagram (one gate) 6. Pinning information 6.1 Pinning 74AUP2G125 1OE GND 4 001aae973 Fig 4. Pin configuration SOT765-1 74AUP2G125 1OE GND 4 Transparent top view Fig 6. Pin configuration SOT996-2 74AUP2G125 Product data sheet nA nOE 2OE 6 1Y ...
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... NXP Semiconductors 6.2 Pin description Table 3. Pin description Symbol Pin SOT765-1, SOT833-1, SOT1089, SOT996-2, SOT1116 and SOT1203 1OE, 2OE GND 4 1Y Functional description [1] Table 4. Function table Input nOE [ HIGH voltage level LOW voltage level; ...
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... NXP Semiconductors 9. Recommended operating conditions Table 6. Operating conditions Symbol Parameter V supply voltage CC V input voltage I V output voltage O T ambient temperature amb t/V input transition rise and fall rate 10. Static characteristics Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). ...
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... NXP Semiconductors Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter I input leakage current I I OFF-state output current OZ I power-off leakage current OFF I additional power-off OFF leakage current I supply current CC I additional supply current CC C input capacitance ...
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... NXP Semiconductors Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter V LOW-level output voltage OL I input leakage current I I OFF-state output current OZ I power-off leakage current OFF I additional power-off OFF leakage current I supply current CC I ...
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... NXP Semiconductors Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter V LOW-level output voltage OL I input leakage current I I OFF-state output current OZ I power-off leakage current OFF I additional power-off OFF leakage current I supply current CC I ...
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... NXP Semiconductors Table 8. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit see Symbol Parameter Conditions t enable time nOE to nY; see en t disable time nOE to nY; see dis propagation delay nA to nY; see pd t enable time nOE to nY; see ...
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... NXP Semiconductors Table 8. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit see Symbol Parameter Conditions propagation delay nA to nY; see pd t enable time nOE to nY; see en t disable time nOE to nY; see dis propagation delay nA to nY; see ...
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... NXP Semiconductors Table 8. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit see Symbol Parameter Conditions t disable time nOE to nY; see dis pF and power dissipation output enabled capacitance V I [1] All typical values are measured at nominal V ...
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... NXP Semiconductors 12. Waveforms Measurement points are given in Logic levels: V and Fig 8. The data input (nA) to output (nY) propagation delays Table 9. Measurement points Supply voltage Output 0.5 3.6 V nOE input output LOW-to-OFF OFF-to-LOW output HIGH-to-OFF OFF-to-HIGH ...
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... NXP Semiconductors Test data is given in Table Definitions for test circuit Load resistance Load capacitance including jig and probe capacitance Termination resistance should be equal to the output impedance External voltage for measuring switching times. EXT Fig 10. Test circuit for measuring switching times Table 11 ...
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... NXP Semiconductors 13. Package outline VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2 pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0. 0.12 0.00 0.60 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. ...
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... NXP Semiconductors XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1. 8× (2) terminal 1 index area DIMENSIONS (mm are the original dimensions) ( UNIT b D max max 0.25 2.0 mm 0.5 0.04 0.17 1.9 Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. ...
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... NXP Semiconductors XSON8: extremely thin small outline package; no leads; 8 terminals; body 1. 0.5 mm terminal 1 index area (2) (4× terminal 1 index area Dimensions (1) Unit max 0.5 0.04 0.20 1.40 mm nom 0.15 1.35 min 0.12 1.30 Note 1. Including plating thickness. 2. Visible depending upon used manufacturing technology. Outline version ...
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... NXP Semiconductors XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 0.5 mm terminal 1 index area Dimensions (mm are the original dimensions) (1) Unit max 0.05 0.35 2.1 mm nom 0.5 min 0.00 0.15 1.9 Outline version IEC SOT996-2 Fig 14. Package outline SOT996-2 (XSON8) 74AUP2G125 Product data sheet ...
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... NXP Semiconductors XQFN8: plastic, extremely thin quad flat package; no leads; 8 terminals; body 1.6 x 1 terminal 1 index area terminal 1 index area L 1 Dimensions (1) Unit max 0.5 0.05 0.25 1.65 mm nom 0.20 1.60 min 0.00 0.15 1.55 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. Outline ...
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... NXP Semiconductors XSON8: extremely thin small outline package; no leads; 8 terminals; body 1.2 x 1 (2) (8×) terminal 1 index area Dimensions (1) Unit max 0.35 0.04 0.20 1.25 mm nom 0.15 1.20 min 0.12 1.15 Note 1. Including plating thickness. 2. Visible depending upon used manufacturing technology. Outline version IEC SOT1116 Fig 16. Package outline SOT1116 (XSON8) ...
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... NXP Semiconductors XSON8: extremely thin small outline package; no leads; 8 terminals; body 1.35 x 1 (2) (8×) terminal 1 index area Dimensions (1) Unit max 0.35 0.04 0.20 1.40 mm nom 0.15 1.35 min 0.12 1.30 Note 1. Including plating thickness. 2. Visible depending upon used manufacturing technology. Outline version IEC SOT1203 Fig 17. Package outline SOT1203 (XSON8) ...
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... NXP Semiconductors 14. Abbreviations Table 12. Abbreviations Acronym Description CDM Charged Device Model DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model 15. Revision history Table 13. Revision history Document ID Release date 74AUP2G125 v.10 20130208 • Modifications: For type number 74AUP2G125GD XSON8U has changed to XSON8. ...
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... Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... Product data sheet NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Functional description . . . . . . . . . . . . . . . . . . . 4 8 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 8 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 13 Package outline ...