74LVC1G126GW-R NXP Semiconductors, 74LVC1G126GW-R Datasheet - Page 2

• Manufacturer Part Number: 74LVC1G126GW-R
• Description: Buffers & Line Drivers BUS BUF/LINE 3-STATE
• Manufacturer: NXP Semiconductors

Specifications of 74LVC1G126GW-R

• Product Category: Buffers & Line Drivers
• Rohs: yes
• Number Of Input Lines: 1
• Number Of Output Lines: 1
• Polarity: Non-Inverting
• Supply Voltage - Max: 5.5 V
• Supply Voltage - Min: 1.65 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Package / Case: SOT-353-5
• High Level Output Current: - 32 mA
• Logic Family: LVC
• Logic Type: CMOS
• Low Level Output Current: 32 mA
• Minimum Operating Temperature: - 40 C
• Number Of Channels Per Chip: 1
• Output Type: 3-State
• Propagation Delay Time: 2.3 ns at 2.7 V
• Factory Pack Quantity: 10000
• Part # Aliases: 74LVC1G126GW,165

NXP Semiconductors
3. Ordering information
Table 1.
4. Marking
Table 2.
[1]
5. Functional diagram
74LVC1G126
Product data sheet
Type number
74LVC1G126GW
74LVC1G126GV
74LVC1G126GM
74LVC1G126GF
74LVC1G126GN
Type number
74LVC1G126GW
74LVC1G126GV
74LVC1G126GM
74LVC1G126GF
74LVC1G126GN
74LVC1G126GS
74LVC1G126GX
74LVC1G126GS
74LVC1G126GX
Fig 1.
The pin 1 indicator is located on the lower left corner of the device, below the marking code.
2
1
Logic symbol
Ordering information
Marking codes
A
OE
mna125
Package
Temperature range
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
Y
4
All information provided in this document is subject to legal disclaimers.
Fig 2.
Name
TSSOP5
SC-74A
XSON6
XSON6
XSON6
XSON6
X2SON5
2
1
Rev. 12 — 2 July 2012
IEC logic symbol
OE
Marking
VN
V26
VN
VN
VN
VN
VN
mna126
plastic extremely thin small outline package;
plastic extremely thin small outline package;
extremely thin small outline package; no leads;
Description
plastic thin shrink small outline package;
5 leads; body width 1.25 mm
plastic surface-mounted package; 5 leads
no leads; 6 terminals; body 1  1.45  0.5 mm
no leads; 6 terminals; body 1  1  0.5 mm
6 terminals; body 0.9  1.0  0.35 mm
extremely thin small outline package; no leads;
6 terminals; body 1.0  1.0  0.35 mm
X2SON5: plastic thermal enhanced extremely
thin small outline package; no leads; 5
terminals; body 0.8  0.8  0.35 mm
[1]
4
Fig 3.
OE
A
Bus buffer/line driver; 3-state
Logic diagram
74LVC1G126
© NXP B.V. 2012. All rights reserved.
Version
SOT353-1
SOT753
SOT886
SOT891
SOT1115
SOT1202
SOT1226
mna127
2 of 21
Y