74LVCH16244AEV/G NXP Semiconductors, 74LVCH16244AEV/G Datasheet - Page 2

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74LVCH16244AEV/G

Manufacturer Part Number
74LVCH16244AEV/G
Description
Buffers & Line Drivers 3.3V BUF/LN DRVR
Manufacturer
NXP Semiconductors
Datasheet

Specifications of 74LVCH16244AEV/G

Product Category
Buffers & Line Drivers
Rohs
yes
Number Of Input Lines
16
Number Of Output Lines
16
Polarity
Non-Inverting
Supply Voltage - Max
3.6 V
Supply Voltage - Min
1.2 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Package / Case
VFBGA-56
High Level Output Current
- 24 mA
Logic Family
LVC
Logic Type
CMOS
Low Level Output Current
24 mA
Minimum Operating Temperature
- 40 C
Number Of Channels Per Chip
16
Output Type
3-State
Propagation Delay Time
11 ns at 1.2 V, 3 ns at 3.3 V
Factory Pack Quantity
1820
Part # Aliases
74LVCH16244AEV/G

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
74LVCH16244AEV/G,5
Manufacturer:
NXP Semiconductors
Quantity:
10 000
Part Number:
74LVCH16244AEV/G:5
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
3. Ordering information
Table 1.
4. Functional diagram
74LVC_LVCH16244A
Product data sheet
Type number
74LVC16244ADL
74LVCH16244ADL
74LVC16244ADGG
74LVCH16244ADGG
74LVC16244AEV
74LVCH16244AEV
74LVC16244ABX
74LVCH16244ABX
Fig 1. Logic symbol
47
46
44
43
41
40
38
37
48
1
Pin numbers are shown for SSOP48 and TSSOP48
packages only.
2A0
1OE
2OE
1A0
1A1
1A2
1A3
2A1
2A2
2A3
Ordering information
1Y0
1Y1
1Y2
1Y3
2Y0
2Y1
2Y2
2Y3
Temperature range Package
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
11
12
2
3
5
6
8
9
36
35
33
32
25
30
29
27
26
24
3OE
4OE
3A0
3A1
3A2
3A3
4A0
4A1
4A2
4A3
All information provided in this document is subject to legal disclaimers.
Name
SSOP48
TSSOP48
VFBGA56
HXQFN60
001aae506
3Y0
3Y1
3Y2
3Y3
4Y0
4Y1
4Y2
4Y3
Rev. 12 — 5 March 2012
74LVC16244A; 74LVCH16244A
19
20
22
23
13
14
16
17
16-bit buffer/line driver; 5 V input/output tolerant; 3-state
plastic shrink small outline package; 48 leads;
Description
body width 7.5 mm
plastic thin shrink small outline package;
48 leads; body width 6.1 mm
plastic very thin fine-pitch ball grid array package;
56 balls; body 4.5  7  0.65 mm
plastic compatible thermal enhanced extremely
thin quad flat package; no leads; 60 terminals;
body 4  6  0.5 mm
Fig 2. IEC logic symbol
Pin numbers are shown for SSOP48 and TSSOP48
packages only.
1OE
2OE
3OE
4OE
1A0
1A1
1A2
1A3
2A0
2A1
2A2
2A3
3A0
3A1
3A2
3A3
4A0
4A1
4A2
4A3
48
25
24
47
46
44
43
41
40
38
37
36
35
33
32
30
29
27
26
1
EN1
EN2
EN3
EN4
1
1
1
1
1
2
3
4
001aae231
11
12
13
14
16
17
19
20
22
23
2
3
5
6
8
9
© NXP B.V. 2012. All rights reserved.
1Y0
1Y1
1Y2
1Y3
2Y0
2Y1
2Y2
2Y3
3Y0
3Y1
3Y2
3Y3
4Y0
4Y1
4Y2
4Y3
Version
SOT370-1
SOT362-1
SOT702-1
SOT1134-2
2 of 19

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