74AUP1G125GN,132 NXP Semiconductors, 74AUP1G125GN,132 Datasheet - Page 2

• Manufacturer Part Number: 74AUP1G125GN,132
• Description: Buffers & Line Drivers 3.6 V XSON6
• Manufacturer: NXP Semiconductors

Specifications of 74AUP1G125GN,132

• Rohs: yes
• Polarity: Non-Inverting
• Supply Voltage - Max: 3.6 V
• Supply Voltage - Min: 0.8 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Package / Case: XSON-6
• Factory Pack Quantity: 5000

NXP Semiconductors
3. Ordering information
Table 1.
4. Marking
Table 2.
[1]
5. Functional diagram
74AUP1G125
Product data sheet
Type number
74AUP1G125GW
74AUP1G125GM
74AUP1G125GF
Type number
74AUP1G125GW
74AUP1G125GM
74AUP1G125GF
74AUP1G125GN
74AUP1G125GS
74AUP1G125GX
74AUP1G125GN
74AUP1G125GS
74AUP1G125GX
Fig 1.
The pin 1 indicator is located on the lower left corner of the device, below the marking code.
2
1
Logic symbol
Ordering information
Marking
OE
A
Package
Temperature range Name
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
mna118
Y
4
All information provided in this document is subject to legal disclaimers.
Fig 2.
TSSOP5
XSON6
XSON6
XSON6
XSON6
X2SON5
Rev. 6 — 15 August 2012
2
1
IEC logic symbol
Description
plastic thin shrink small outline package; 5 leads;
body width 1.25 mm
plastic extremely thin small outline package; no leads;
6 terminals; body 1  1.45  0.5 mm
plastic extremely thin small outline package; no leads;
6 terminals; body 1  1  0.5 mm
extremely thin small outline package; no leads;
6 terminals; body 0.9  1.0  0.35 mm
extremely thin small outline package; no leads;
6 terminals; body 1.0  1.0  0.35 mm
X2SON5: plastic thermal enhanced extremely thin
small outline package; no leads; 5 terminals;
body 0.8  0.8  0.35 mm
EN
Marking code
pM
pM
pM
pM
pM
pM
mna119
4
[1]
Low-power buffer/line driver; 3-state
Fig 3.
OE
A
74AUP1G125
Logic diagram
© NXP B.V. 2012. All rights reserved.
001aad068
Version
SOT353-1
SOT886
SOT891
SOT1115
SOT1202
SOT1226
2 of 25
Y