74LVC2G34GS,132 NXP Semiconductors, 74LVC2G34GS,132 Datasheet
74LVC2G34GS,132
Specifications of 74LVC2G34GS,132
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74LVC2G34GS,132 Summary of contents
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Dual buffer gate Rev. 7 — 4 July 2012 1. General description The 74LVC2G34 provides two buffers. Inputs can be driven from either 3 devices. These features allow the use of these devices in a ...
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... NXP Semiconductors 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name 40 C to +125 C 74LVC2G34GW 40 C to +125 C 74LVC2G34GV 40 C to +125 C 74LVC2G34GM 40 C to +125 C 74LVC2G34GF 40 C to +125 C 74LVC2G34GN 40 C to +125 C 74LVC2G34GS 4 ...
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... NXP Semiconductors 6. Pinning information 6.1 Pinning 74LVC2G34 GND 001aab676 Fig 4. Pin configuration SOT363 and SOT457 6.2 Pin description Table 3. Pin description Symbol Pin 1A 1 GND Functional description [1] Table 4. Function table Input [ HIGH voltage level ...
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... NXP Semiconductors 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter V supply voltage CC I input clamping current IK V input voltage I I output clamping current OK V output voltage O I output current ...
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... NXP Semiconductors 10. Static characteristics Table 7. Static characteristics At recommended operating conditions. Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions V HIGH-level input voltage LOW-level input voltage ...
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... NXP Semiconductors 11. Dynamic characteristics Table 8. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for load circuit see Symbol Parameter Conditions t propagation delay nA to nY; see power dissipation capacitance [1] Typical values are measured the same as t and t ...
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... NXP Semiconductors Table 9. Measurement points Supply voltage 1. 2.7 V 2 3 5.5 V Test data is given in Table Definitions for test circuit Load resistance Load capacitance including jig and probe capacitance Termination resistance should be equal to the output impedance External voltage for measuring switching times ...
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... NXP Semiconductors 13. Package outline Plastic surface-mounted package; 6 leads y 6 pin 1 index DIMENSIONS (mm are the original dimensions UNIT max 1.1 0.30 0.25 mm 0.1 0.8 0.20 0.10 OUTLINE VERSION IEC SOT363 Fig 9. Package outline SOT363 (SC-88) 74LVC2G34 Product data sheet scale ...
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... NXP Semiconductors Plastic surface-mounted package (TSOP6); 6 leads y 6 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) UNIT 0.1 1.1 0.40 0.26 mm 0.013 0.9 0.25 0.10 OUTLINE VERSION IEC SOT457 Fig 10. Package outline SOT457 (TSOP6) 74LVC2G34 Product data sheet scale ...
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... NXP Semiconductors XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1. (2) terminal 1 index area Dimensions (mm are the original dimensions) (1) Unit max 0.5 0.04 0.25 1.50 mm nom 0.20 1.45 min 0.17 1.40 Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. Outline version ...
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... NXP Semiconductors XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 0 6× (1) terminal 1 index area DIMENSIONS (mm are the original dimensions UNIT b D max max 0.20 1.05 mm 0.5 0.04 0.12 0.95 Note 1. Can be visible in some manufacturing processes. OUTLINE VERSION IEC SOT891 Fig 12. Package outline SOT891 (XSON6) ...
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... NXP Semiconductors XSON6: extremely thin small outline package; no leads; 6 terminals; body 0.9 x 1 (6×) terminal 1 index area Dimensions (1) Unit max 0.35 0.04 0.20 0.95 mm nom 0.15 0.90 min 0.12 0.85 Note 1. Including plating thickness. 2. Visible depending upon used manufacturing technology. Outline version IEC SOT1115 Fig 13. Package outline SOT1115 (XSON6) ...
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... NXP Semiconductors XSON6: extremely thin small outline package; no leads; 6 terminals; body 1.0 x 1 (6×) terminal 1 index area Dimensions (1) Unit max 0.35 0.04 0.20 1.05 mm nom 0.15 1.00 min 0.12 0.95 Note 1. Including plating thickness. 2. Visible depending upon used manufacturing technology. Outline version IEC SOT1202 Fig 14. Package outline SOT1202 (XSON6) ...
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... NXP Semiconductors 14. Abbreviations Table 11. Abbreviations Acronym Description DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic 15. Revision history Table 12. Revision history Document ID Release date 74LVC2G34 v.7 20120704 • Modifications: Package outline drawing of SOT886 74LVC2G34 v.6 20111129 • ...
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... Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... Product data sheet NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Functional description . . . . . . . . . . . . . . . . . . . 3 8 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 6 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 13 Package outline ...