74LVC1GU04GW-G NXP Semiconductors, 74LVC1GU04GW-G Datasheet
74LVC1GU04GW-G
Specifications of 74LVC1GU04GW-G
Related parts for 74LVC1GU04GW-G
74LVC1GU04GW-G Summary of contents
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... Specified from 40 C to +85 C and 40 C to +125 C 3. Ordering information Table 1. Ordering information Type number Package Temperature range 40 C to +125 C 74LVC1GU04GW 40 C to +125 C 74LVC1GU04GV 40 C to +125 C 74LVC1GU04GM 40 C to +125 C 74LVC1GU04GF 40 C to +125 C 74LVC1GU04GN ...
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... NXP Semiconductors 4. Marking Table 2. Marking codes Type number 74LVC1GU04GW 74LVC1GU04GV 74LVC1GU04GM 74LVC1GU04GF 74LVC1GU04GN 74LVC1GU04GS 74LVC1GU04GX [1] The pin 1 indicator is located on the lower left corner of the device, below the marking code. 5. Functional diagram mna108 Fig 1. Logic symbol 6. Pinning information 6.1 Pinning 74LVC1GU04 n ...
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... NXP Semiconductors 74LVC1GU04 n. GND 3 Transparent top view Fig 6. Pin configuration SOT891, SOT1115 and SOT1202 6.2 Pin description Table 3. Pin description Symbol Pin TSSOP5 and X2SON5 n. GND n. Functional description [1] Table 4. Function table Input ( [ HIGH voltage level LOW voltage level. ...
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... NXP Semiconductors 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter V supply voltage CC I input clamping current IK V input voltage I I output clamping current OK V output voltage O I output current ...
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... NXP Semiconductors 10. Static characteristics Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter = 40 C to +85 C T amb V HIGH-level input voltage IH V LOW-level input voltage IL V HIGH-level output voltage LOW-level output voltage input leakage current ...
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... NXP Semiconductors Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter V LOW-level output voltage input leakage current I I supply current CC [1] All typical values are measured at V 11. Dynamic characteristics Table 8. Dynamic characteristics Voltages are referenced to GND (ground = 0 V). For test circuit see ...
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... NXP Semiconductors 12. Waveforms Measurement points are given in V and V are typical output voltage drop that occur with the output load Fig 8. The input A to output Y propagation delay times Table 9. Measurement points Supply voltage 1. 2.7 V 2 3 5.5 V ...
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... NXP Semiconductors Test data is given in Table Definitions for test circuit Load resistance Load capacitance including jig and probe capacitance Termination resistance should be equal to the output impedance External voltage for measuring switching times. EXT Fig 11. Test circuit for measuring switching times Table 10 ...
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... NXP Semiconductors 13. Application information Some applications are: • Linear amplifier (see • In crystal oscillator design (see Remark: All values given are typical unless otherwise specified μF R1 U04 1.5 V centered at 0. o(p- – ----------------------------------------- - u R1 ------ - loop gain. ...
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... NXP Semiconductors 14. Package outline TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1. DIMENSIONS (mm are the original dimensions UNIT max. 0.1 1.0 mm 1.1 0.15 0 0.8 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE ...
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... NXP Semiconductors Plastic surface-mounted package; 5 leads DIMENSIONS (mm are the original dimensions) UNIT 0.100 1.1 0.40 0.26 mm 0.013 0.9 0.25 0.10 OUTLINE VERSION IEC SOT753 Fig 15. Package outline SOT753 (SC-74A) 74LVC1GU04 Product data sheet scale ...
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... NXP Semiconductors XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1. (2) terminal 1 index area Dimensions (mm are the original dimensions) (1) Unit max 0.5 0.04 0.25 1.50 mm nom 0.20 1.45 min 0.17 1.40 Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. Outline version ...
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... NXP Semiconductors XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 0 6× (1) terminal 1 index area DIMENSIONS (mm are the original dimensions UNIT b D max max 0.20 1.05 mm 0.5 0.04 0.12 0.95 Note 1. Can be visible in some manufacturing processes. OUTLINE VERSION IEC SOT891 Fig 17. Package outline SOT891 (XSON6) ...
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... NXP Semiconductors XSON6: extremely thin small outline package; no leads; 6 terminals; body 0.9 x 1 (6×) terminal 1 index area Dimensions (1) Unit max 0.35 0.04 0.20 0.95 mm nom 0.15 0.90 min 0.12 0.85 Note 1. Including plating thickness. 2. Visible depending upon used manufacturing technology. Outline version IEC SOT1115 Fig 18. Package outline SOT1115 (XSON6) ...
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... NXP Semiconductors XSON6: extremely thin small outline package; no leads; 6 terminals; body 1.0 x 1 (6×) terminal 1 index area Dimensions (1) Unit max 0.35 0.04 0.20 1.05 mm nom 0.15 1.00 min 0.12 0.95 Note 1. Including plating thickness. 2. Visible depending upon used manufacturing technology. Outline version IEC SOT1202 Fig 19. Package outline SOT1202 (XSON6) ...
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... NXP Semiconductors X2SON5: plastic thermal enhanced extremely thin small outline package; no leads; 5 terminals; body 0.8 x 0 terminal 1 index area e 1 terminal 1 index area Dimensions (1) Unit max 0.35 0.04 0.128 0.85 mm nom 0.80 min 0.040 0.75 Note 1. Dimension A is including plating thickness. 2. Plastic or metal protrusions of 0.075 mm maximum per side are not included. ...
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... NXP Semiconductors 15. Abbreviations Table 11. Abbreviations Acronym Description CMOS Complementary Metal Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model 16. Revision history Table 12. Revision history Document ID Release date 74LVC1GU04 v.11 20120702 • Modifications: Added type number 74LVC1GU04GX (SOT1226) • ...
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... Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... Product data sheet NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... NXP Semiconductors 19. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Functional description . . . . . . . . . . . . . . . . . . . 3 8 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 6 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 13 Application information ...