MAX9263GCB/V+T Maxim Integrated, MAX9263GCB/V+T Datasheet - Page 2
![no-image](/images/no-image-200.jpg)
MAX9263GCB/V+T
Manufacturer Part Number
MAX9263GCB/V+T
Description
Serializers & Deserializers - Serdes GMSL Serializer w/HDCP Interface
Manufacturer
Maxim Integrated
Datasheet
1.MAX9263GCBVT.pdf
(71 pages)
2
HDCP Gigabit Multimedia Serial
Link Serializer/Deserializer
ABSOLUTE MAXIMUM RATINGS
AVDD to AGND
DVDD to GND (MAX9263) ...................................-0.5V to +1.9V
DVDD to DGND (MAX9264) .................................-0.5V to +3.9V
IOVDD to GND (MAX9263) ..................................-0.5V to +3.9V
IOVDD to IOGND (MAX9264) ..............................-0.5V to +3.9V
Any Ground to Any Ground .................................-0.5V to +0.5V
OUT+, OUT- to AGND (MAX9263) ......................-0.5V to +1.9V
IN+, IN- to AGND (MAX9264) ..............................-0.5V to +1.9V
PACKAGE THERMAL CHARACTERISTICS (Note 1)
64 TQFP-EP
Junction-to-Ambient Thermal Resistance (B
Junction-to-Case Thermal Resistance (B
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
MAX9263 DC ELECTRICAL CHARACTERISTICS
(V
Typical values are at V
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
SINGLE-ENDED INPUTS (DIN_, PCLKIN, SD, SCK, WS, AUTOS, MS, CDS, PWDN, SSEN, DRS, ES, BWS)
High-Level Input Voltage
Low-Level Input Voltage
Input Current
Input Clamp Voltage
SINGLE-ENDED OUTPUT (INT)
High-Level Output Voltage
Low-Level Output Voltage
OUTPUT Short-Circuit Current
I
High-Level Input Voltage
Low-Level Input Voltage
MAX9263 ............................................................-0.5V to +1.9V
MAX9264 ............................................................-0.5V to +3.9V
2
AVDD
C/UART, I/O, AND OPEN-DRAIN OUTPUTS (RX/SDA, TX/SCL, LFLT)
= V
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PARAMETER
DVDD
= 1.7V to 1.9V, V
AVDD
= V
DVDD
IOVDD
SYMBOL
= V
V
V
V
V
V
V
V
I
JC
I
OH1
IN1
OL1
= 1.7V to 3.6V, R
OS
IH1
IH2
IL1
IL2
CL
IOVDD
) .....................1NC/W
JA
) ...........39.1NC/W
= 1.8V, T
DIN_, PCLKIN, AUTOS, MS, CDS, SSEN,
DRS, ES, BWS
SD, SCK, WS
V
I
I
I
V
CL
OUT
OUT
IN
O
= V
= -18mA
= 0 to V
= -2mA
= 2mA
GND
L
A
= 100I Q1% (differential), T
= +25NC.)
IOVDD
CONDITIONS
V
V
IOVDD
IOVDD
LMN_ to AGND (MAX9263)
All Other Pins to GND (MAX9263) ...... -0.5V to (V
All Other Pins to IOGND (MAX9264) ... -0.5V to (V
Continuous Power Dissipation (T
Operating Temperature Range ........................ -40NC to +105NC
Junction Temperature .....................................................+150NC
Storage Temperature Range ............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
64-Pin TQFP (derate 31.3mW/NC above +70NC) .....2507.8mW
(15mA current limit) ..........................................-0.5V to +3.9V
= 3.0V to 3.6V
= 1.7V to 1.9V
A
= -40NC to +105NC, unless otherwise noted.
V
V
V
V
0.65 x
IOVDD
0.7 x
IOVDD
IOVDD
0.7 x
IOVDD
- 0.2
MIN
-10
16
3
A
= +70NC )
TYP
35
12
V
V
0.35 x
MAX
IOVDD
0.3 x
IOVDD
+10
-1.5
0.2
64
21
IOVDD
IOVDD
UNITS
+ 0.5V)
+ 0.5V)
mA
FA
V
V
V
V
V
V
V