iCE65L01F-LQN84C Lattice, iCE65L01F-LQN84C Datasheet - Page 3

• Manufacturer Part Number: iCE65L01F-LQN84C
• Description: FPGA - Field Programmable Gate Array iCE65 1280 LUTs, 1.0 1.2V Ultra Low-Power
• Manufacturer: Lattice

Specifications of iCE65L01F-LQN84C

• Rohs: yes
• Number Of Gates: 1280
• Number Of Logic Blocks: 16
• Number Of I/os: 67
• Maximum Operating Frequency: 256 MHz
• Operating Supply Voltage: 1.2 V
• Maximum Operating Temperature: + 70 C
• Mounting Style: SMD/SMT
• Package / Case: QFN-84
• Distributed Ram: 64 Kbit
• Minimum Operating Temperature: 0 C
• Operating Supply Current: 12 uA
• Factory Pack Quantity: 260

Packaging Options
81-ball chip-scale BGA
84-pin quad flat no-lead package
100-pin very thin quad flat package
121-ball chip-scale BGA
132-ball chip-scale BGA
196-ball chip-scale BGA
284-ball chip-scale BGA
Known Good Die
The iCE65L04 and the iCE65L08 are both available in the CB196 package and have similar footprints but are not completely pin
compatible. See
Lattice Semiconductor Corporation
www.latticesemi.com
= Common footprint allows each density migration on the same printed circuit board.
iCE65 components are available in a variety of package options to support specific application requirements. The
available options, including the number of available user-programmable I/O pins (PIOs), are listed in Table 2. Fully-
tested Known-Good Die (KGD) DiePlus
iCE65 devices are provided exclusively in Pb-free, RoHS-compliant packages.
When iCE65 components are supplied in the same package style, devices of different gate densities share a common
footprint. The common footprint improves manufacturing flexibility. Different models of the same product can
share a common circuit board. Feature-rich versions of the end application mount a larger iCE65 device on the
circuit board. Low-end versions mount a smaller iCE65 device.
Package
“Pinout Differences between iCE65L04 and iCE65L08 in CB196
Table 2:
iCE65 Family Packaging Options, Maximum I/O per Package
See DiePlus
data sheet
Package
14 x 14
12 x 12
(mm)
Body
5 x 5
7 x 7
6 x 6
8 x 8
8 x 8
™
are available for die stacking and highly space-conscious applications. All
Package
VQ100
CB121
CB132
CB196
CB284
Code
QN84
CB81
DI
Ball/Lead
(mm)
Pitch
0.5
0.5
0.5
0.5
—
Package” on page
65L01
63
67
72
92
93
95
—
—
(0)
(0)
(0)
(0)
(0)
(0)
(Differential input count)
73
for more information.
65L04
150
176
176
95
72
—
—
—
(11)
(9)
(18)
(20)
(20)
(2.42, 30-MAR-2011)
.
65L08
150
222
222
95
—
—
—
—
(12)
(18)
(25)
(25)
3