LFE3-17EA-7MG328I Lattice, LFE3-17EA-7MG328I Datasheet - Page 124
LFE3-17EA-7MG328I
Manufacturer Part Number
LFE3-17EA-7MG328I
Description
FPGA - Field Programmable Gate Array 17.3K LUTs 116 I/O 1.2V -7 SPEED
Manufacturer
Lattice
Datasheet
1.LFE3-95EA-7LFN672I.pdf
(141 pages)
Specifications of LFE3-17EA-7MG328I
Rohs
yes
Number Of Gates
17 K
Number Of Logic Blocks
38
Embedded Block Ram - Ebr
700 Kbit
Number Of I/os
116
Operating Supply Voltage
1.2 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Package / Case
CSBGA-328
Distributed Ram
36 Kbit
Minimum Operating Temperature
- 40 C
Operating Supply Current
49.4 mA
Factory Pack Quantity
168
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LFE3-17EA-7MG328I
Manufacturer:
Lattice Semiconductor Corporation
Quantity:
10 000
Part Number:
LFE3-17EA-7MG328I
Manufacturer:
LATTICE
Quantity:
20 000
- Current page: 124 of 141
- Download datasheet (11Mb)
Logic Signal Connections
Package pinout information can be found under “Data Sheets” on the LatticeECP3 product pages on the Lattice
website at
pinout information from within ispLEVER Design Planner, select View > Package View. Then select Select File >
Export and choose a type of output file. To create a pin information file from within Diamond select Tools >
Spreadsheet View or Tools >Package View; then, select File > Export and choose a type of output file. See Dia-
mond or ispLEVER Help for more information.
Thermal Management
Thermal management is recommended as part of any sound FPGA design methodology. To assess the thermal
characteristics of a system, Lattice specifies a maximum allowable junction temperature in all device data sheets.
Designers must complete a thermal analysis of their specific design to ensure that the device and package do not
exceed the junction temperature limits. Refer to the Thermal Management document to find the device/package
specific thermal values.
For Further Information
For further information regarding Thermal Management, refer to the following:
•
• TN1181,
• Power Calculator tool included with the Diamond and ispLEVER design tools, or as a standalone download from
Thermal Management
www.latticesemi.com/software
www.latticesemi.com/products/fpga/ecp3
Power Consumption and Management for LatticeECP3 Devices
document
and in the Diamond or ispLEVER software tools. To create
4-10
LatticeECP3 Family Data Sheet
Pinout Information
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