iCE40HX8K-CM225 Lattice, iCE40HX8K-CM225 Datasheet - Page 2
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iCE40HX8K-CM225
Manufacturer Part Number
iCE40HX8K-CM225
Description
FPGA - Field Programmable Gate Array iCE40HX 7680 LUTs, 1.2V Ultra Low-Power
Manufacturer
Lattice
Datasheet
1.ICE40HX8K-CT256.pdf
(12 pages)
Specifications of iCE40HX8K-CM225
Rohs
yes
Number Of Gates
7680
Number Of Logic Blocks
32
Number Of I/os
178
Maximum Operating Frequency
533 MHz
Operating Supply Voltage
1.2 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Package / Case
CBGA-225
Distributed Ram
128 Kbit
Minimum Operating Temperature
- 40 C
Factory Pack Quantity
260
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
ICE40HX8K-CM225
Manufacturer:
Lattice Semiconductor Corporation
Quantity:
10 000
Part Number:
ICE40HX8K-CM225
Manufacturer:
SILI
Quantity:
20 000
iCE40 HX-Series Ultra-Low Power mobileFPGA
Ordering Information
Lattice Semiconductor Corporation
www.latticesemi.com/
Figure 2
when ordering die-based products. See the separate iCE40 Pinout Excel files for package and pinout specifications.
640, 1K, 4K, 8K
describes the iCE40HX ordering codes for all packaged components. See the separate DiePlus data sheets
High Performance
Logic Cells
Figure 2:
Series
iCE40HX 8K - CM 225
iCE40HX Ordering Codes (packaged, non-die components)
225-ball Chip-Scale BGA Package
(7x7 mm footprint, 0.4 mm pitch)
iCE40HX8K-CM225
CM
CB
C
VQ = Very Thin Quad flat pack (0.5 mm pitch)
TQ = Thin Quad flat pack (0.5 mm pitch)
QN
T
= chip-scale ball grid (0.8 mm pitch)
™
= chip-scale ball grid (0.4 mm pitch)
= chip-scale ball grid (0.5 mm pitch)
= quad flat no-lead (0.5 mm pitch)
Family
Package Leads
Package Style
(1.31, 30-MAR-2012)
2