LCMXO2-256HC-6SG32C Lattice, LCMXO2-256HC-6SG32C Datasheet - Page 84

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LCMXO2-256HC-6SG32C

Manufacturer Part Number
LCMXO2-256HC-6SG32C
Description
FPGA - Field Programmable Gate Array 256 LUTs 22 I/O 3.3V -6 Speed
Manufacturer
Lattice
Datasheet

Specifications of LCMXO2-256HC-6SG32C

Rohs
yes
Number Of Gates
256
Number Of Logic Blocks
32
Embedded Block Ram - Ebr
0 Kbit
Number Of I/os
22
Maximum Operating Frequency
388 MHz
Operating Supply Voltage
2.5 V, 3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Package / Case
QFN-32
Distributed Ram
2 Kbit
Operating Supply Current
1.15 mA
Factory Pack Quantity
490

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For Further Information
For further information regarding logic signal connections for various packages please refer to the MachXO2
Device Pinout Files.
Thermal Management
Thermal management is recommended as part of any sound FPGA design methodology. To assess the thermal
characteristics of a system, Lattice specifies a maximum allowable junction temperature in all device data sheets.
Users must complete a thermal analysis of their specific design to ensure that the device and package do not
exceed the junction temperature limits. Refer to the Thermal Management document to find the device/package
specific thermal values.
For Further Information
For further information regarding Thermal Management, refer to the following:
• TN1198,
• The Power Calculator tool is included with the Lattice design tools, or as a standalone download from
Thermal Management
www.latticesemi.com/software
Power Estimation and Management for MachXO2 Devices
document
4-8
MachXO2 Family Data Sheet
Pinout Information

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