MC14504BDR2G ON Semiconductor, MC14504BDR2G Datasheet - Page 7

• Manufacturer Part Number: MC14504BDR2G
• Description: IC TRANSLATOR HEX CMOS 16SOIC
• Manufacturer: ON Semiconductor
• Series: 4000Br

Specifications of MC14504BDR2G

• Logic Function: Level Shifter
• Number Of Bits: 6
• Input Type: TTL, CMOS
• Output Type: CMOS
• Number Of Channels: 6
• Number Of Outputs/channel: 1
• Differential - Input:output: No/No
• Propagation Delay (max): 280ns
• Voltage - Supply: 3 V ~ 18 V
• Operating Temperature: -55°C ~ 125°C
• Package / Case: 16-SOIC (3.9mm Width)
• Supply Voltage: 3 V ~ 18 V
• Logic Family: 4000
• Technology: CMOS
• High Level Output Current: -4.2mA
• Low Level Output Current: 4.2mA
• Translation: CMOS/TTL to CMOS
• Operating Supply Voltage (typ): 3.3/5/9/12/15V
• Package Type: SOIC
• Quiescent Current: 5uA
• Operating Supply Voltage (max): 18V
• Operating Supply Voltage (min): 3V
• Abs. Propagation Delay Time: 550ns
• Mounting: Surface Mount
• Pin Count: 16
• Operating Temperature (min): -55
• Operating Temperature (max): 125C
• Operating Temperature Classification: Military
• Logic Type: Voltage Level Translator
• Input Bias Current (max): 5 mA
• Propagation Delay Time: 550 ns
• Supply Voltage (max): 18 V
• Supply Voltage (min): 3 V
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 55 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Data Rate: -
• Lead Free Status / Rohs Status: Compliant
• Other names: MC14504BDR2GOS; MC14504BDR2GOS; MC14504BDR2GOSTR

e
16
1
0.13 (0.005)
Z
b
D
M
9
8
A
E
0.10 (0.004)
A
H
1
E
VIEW P
PLASTIC EIAJ SOIC PACKAGE
PACKAGE DIMENSIONS
M
_
http://onsemi.com
L
E
CASE 966−01
MC14504B
SOEIAJ−16
F SUFFIX
ISSUE O
L
DETAIL P
7
Q
1
c
NOTES:
1.
2.
3.
4.
5.
Y14.5M, 1982.
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
REFERENCE ONLY.
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
H
DIM
A
L
M
A
b
c
D
E
e
L
Q
Z
E
E
1
DIMENSIONING AND TOLERANCING PER ANSI
CONTROLLING DIMENSION: MILLIMETER.
DIMENSIONS D AND E DO NOT INCLUDE
TERMINAL NUMBERS ARE SHOWN FOR
THE LEAD WIDTH DIMENSION (b) DOES NOT
1
MILLIMETERS
MIN
0.05
0.35
0.18
9.90
5.10
7.40
0.50
0.70
1.10
−−−
−−−
0
1.27 BSC
_
10.50
MAX
10
2.05
0.20
0.50
0.27
5.45
8.20
0.85
1.50
0.90
0.78
_
0.002
0.014
0.007
0.390
0.201
0.291
0.020
0.043
0.028
MIN
−−−
−−−
0.050 BSC
0
INCHES
_
0.081
0.008
0.020
0.413
0.215
0.323
0.033
0.059
0.035
0.031
MAX
0.011
10
_