MC14504BDR2G ON Semiconductor, MC14504BDR2G Datasheet - Page 5

• Manufacturer Part Number: MC14504BDR2G
• Description: IC TRANSLATOR HEX CMOS 16SOIC
• Manufacturer: ON Semiconductor
• Series: 4000Br

Specifications of MC14504BDR2G

• Logic Function: Level Shifter
• Number Of Bits: 6
• Input Type: TTL, CMOS
• Output Type: CMOS
• Number Of Channels: 6
• Number Of Outputs/channel: 1
• Differential - Input:output: No/No
• Propagation Delay (max): 280ns
• Voltage - Supply: 3 V ~ 18 V
• Operating Temperature: -55°C ~ 125°C
• Package / Case: 16-SOIC (3.9mm Width)
• Supply Voltage: 3 V ~ 18 V
• Logic Family: 4000
• Technology: CMOS
• High Level Output Current: -4.2mA
• Low Level Output Current: 4.2mA
• Translation: CMOS/TTL to CMOS
• Operating Supply Voltage (typ): 3.3/5/9/12/15V
• Package Type: SOIC
• Quiescent Current: 5uA
• Operating Supply Voltage (max): 18V
• Operating Supply Voltage (min): 3V
• Abs. Propagation Delay Time: 550ns
• Mounting: Surface Mount
• Pin Count: 16
• Operating Temperature (min): -55
• Operating Temperature (max): 125C
• Operating Temperature Classification: Military
• Logic Type: Voltage Level Translator
• Input Bias Current (max): 5 mA
• Propagation Delay Time: 550 ns
• Supply Voltage (max): 18 V
• Supply Voltage (min): 3 V
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 55 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Data Rate: -
• Lead Free Status / Rohs Status: Compliant
• Other names: MC14504BDR2GOS; MC14504BDR2GOS; MC14504BDR2GOSTR

−T−
16
1
SEATING
PLANE
H
16
1
−A−
G
G
D
0.25 (0.010)
−A−
16 PL
F
D
9
8
16 PL
0.25 (0.010)
M
B
S
T
9
8
K
B
K
C
M
−B−
S
−T−
T
A
A
C
S
P
SEATING
PLANE
PACKAGE DIMENSIONS
M
PLASTIC SOIC PACKAGE
PLASTIC DIP PACKAGE
8 PL
http://onsemi.com
0.25 (0.010)
CASE 751B−05
J
CASE 648−08
MC14504B
D SUFFIX
P SUFFIX
M
SOIC−16
PDIP−16
ISSUE T
ISSUE J
5
M
L
R
B
X 45
S
_
M
J
F
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS
4. DIMENSION B DOES NOT INCLUDE
5. ROUNDED CORNERS OPTIONAL.
ANSI Y14.5M, 1982.
WHEN FORMED PARALLEL.
MOLD FLASH.
DIM
A
B
C
D
G
H
K
M
F
J
L
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
5. DIMENSION D DOES NOT INCLUDE DAMBAR
0.740
0.250
0.145
0.015
0.040
0.008
0.295
0.020
0.110
MIN
0.100 BSC
0.050 BSC
Y14.5M, 1982.
MOLD PROTRUSION.
PER SIDE.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
0
DIM
INCHES
A
B
C
D
G
K
M
P
R
F
J
_
0.770
0.270
0.175
0.021
0.015
0.130
0.305
0.040
MAX
MILLIMETERS
MIN
0.70
9.80
3.80
1.35
0.35
0.40
0.19
0.10
5.80
0.25
10
0
1.27 BSC
_
_
10.00
18.80
MAX
MILLIMETERS
4.00
1.75
0.49
1.25
0.25
0.25
6.20
0.50
6.35
3.69
0.39
1.02
0.21
2.80
7.50
0.51
MIN
7
2.54 BSC
1.27 BSC
0
_
_
0.386
0.150
0.054
0.014
0.016
0.008
0.004
0.229
0.010
MIN
19.55
MAX
0.050 BSC
6.85
4.44
0.53
1.77
0.38
3.30
7.74
1.01
0
10
INCHES
_
_
MAX
0.393
0.157
0.068
0.019
0.049
0.009
0.009
0.244
0.019
7
_