AT24C01C-SSHM-B Atmel, AT24C01C-SSHM-B Datasheet - Page 18

• Manufacturer Part Number: AT24C01C-SSHM-B
• Description: EEPROM 1K 2-WIRE 8 SOIC PB HALOFREE NiPdAu 1.7V
• Manufacturer: Atmel

Specifications of AT24C01C-SSHM-B

• Rohs: yes
• Memory Size: 1 kbit
• Organization: 128 x 8
• Data Retention: 100 yr
• Maximum Clock Frequency: 400 kHz, 1 GHz
• Maximum Operating Current: 3 mA
• Operating Supply Voltage: 1.7 V to 5.5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Package / Case: SOIC-8
• Interface Type: 2-Wire, I2C
• Minimum Operating Temperature: - 55 C
• Operating Current: 1 mA
• Supply Voltage - Max: 5.5 V
• Supply Voltage - Min: 1.7 V

13.3
8X — 8-lead TSSOP
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Package Drawing Contact:
Notes:
1. This drawing is for general information only.
2. Dimension D does not include mold Flash, protrusions or gate
3. Dimension E1 does not include inter-lead Flash or protrusions.
4. Dimension b does not include Dambar protrusion.
5. Dimension D and E1 to be determined at Datum Plane H.
Top View
burrs. Mold Flash, protrusions and gate burrs shall not exceed
0.15mm (0.006in) per side.
Inter-lead Flash and protrusions shall not exceed 0.25mm
(0.010in) per side.
Side View
Refer to JEDEC Drawing MO-153, Variation AA, for proper
dimensions, tolerances, datums, etc.
Allowable Dambar protrusion shall be 0.08mm total in excess
of the b dimension at maximum material condition. Dambar
cannot be located on the lower radius of the foot. Minimum
space between protrusion and adjacent lead is 0.07mm.
Pin 1 indicator
this corner
D
b
e
1
N
A2
8X, 8-lead 4.4mm Body, Plastic Thin
Shrink Small Outline Package (TSSOP)
TITLE
E1
A
A1
E
End View
Atmel AT24C01C/02C [DATASHEET]
SYMBOL
C
A
A1
A2
D
E
E1
b
e
L
L1
C
0.05
0.80
2.90
4.30
0.19
0.45
COMMON DIMENSIONS
MIN
L
(Unit of Measure = mm)
-
L1
GPC
0.65 BSC
1.00 REF
TNR
NOM
1.00
3.00
4.40
0.60
0.09
–
-
-
DRAWING NO.
6.40 BSC
8700F–SEEPR–6/12
MAX
1.20
0.15
1.05
3.10
4.50
0.30
0.75
-
8X
NOTE
0.20
2, 5
3, 5
4
6/22/11
REV.
D
18