LPC1112FHN24/2021 NXP Semiconductors, LPC1112FHN24/2021 Datasheet - Page 93

• Manufacturer Part Number: LPC1112FHN24/2021
• Description: ARM Microcontrollers - MCU
• Manufacturer: NXP Semiconductors

Specifications of LPC1112FHN24/2021

• Rohs: yes
• Core: ARM Cortex M0
• Processor Series: LPC1112
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 50 MHz
• Program Memory Size: 16 KB
• Data Ram Size: 2 KB
• On-chip Adc: Yes
• Operating Supply Voltage: 1.8 V to 3.6 V
• Package / Case: HVQFN-24
• Mounting Style: SMD/SMT
• Factory Pack Quantity: 2450

NXP Semiconductors
12. Package outline
Fig 50. Package outline SOT163-1 (SO20)
LPC111X
Product data sheet
SO20: plastic small outline package; 20 leads; body width 7.5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
inches
UNIT
mm
VERSION
OUTLINE
SOT163-1
max.
2.65
0.1
A
20
1
Z
y
0.012
0.004
A
0.3
0.1
1
pin 1 index
0.096
0.089
2.45
2.25
A
2
075E04
IEC
0.25
0.01
e
A
3
D
0.019
0.014
0.49
0.36
b
p
0.013
0.009
All information provided in this document is subject to legal disclaimers.
0.32
0.23
MS-013
JEDEC
c
0
b
REFERENCES
0.51
0.49
13.0
12.6
D
p
Rev. 8 — 20 February 2013
(1)
11
10
0.30
0.29
E
w
7.6
7.4
(1)
M
JEITA
scale
1.27
0.05
5
e
c
10.65
10.00
0.419
0.394
H
E
LPC1110/11/12/13/14/15
A
2
0.055
A
1.4
L
1
10 mm
0.043
0.016
32-bit ARM Cortex-M0 microcontroller
1.1
0.4
L
p
H
E
E
detail X
0.043
0.039
1.1
1.0
Q
L
PROJECTION
L
EUROPEAN
p
0.25
0.01
Q
v
(A )
3
0.25
0.01
w
A
θ
A
0.004
0.1
© NXP B.V. 2013. All rights reserved.
y
X
v
ISSUE DATE
M
99-12-27
03-02-19
0.035
0.016
Z
0.9
0.4
A
(1)
SOT163-1
θ
8
0
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