MPXN2120VMG116 Freescale Semiconductor, MPXN2120VMG116 Datasheet - Page 27

• Manufacturer Part Number: MPXN2120VMG116
• Description: Microprocessors - MPU 32BIT2M NVM GATEWAY
• Manufacturer: Freescale Semiconductor

Specifications of MPXN2120VMG116

• Rohs: yes
• Processor Series: PXN21
• Core: e200
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 60 MHz
• Program Memory Size: 2 MB
• Data Ram Size: 32 KB
• Interface Type: CAN, I2C, SPI, UART
• Operating Supply Voltage: - 0.3 V to + 1.32 V
• Maximum Operating Temperature: + 150 C
• Mounting Style: SMD/SMT
• Package / Case: MAPBGA-208
• Number Of Programmable I/os: 155

8
9
10
11
12
13
14
15
4.2
1
2
3
4
5
6
4.2.1
An estimation of the chip junction temperature, T
Freescale Semiconductor
Spec
V
power segments.
AC signal over and undershoot of the input voltages of up to ±2.0 V is permitted for a cumulative duration of 60 hours over the
complete lifetime of the device (injection current does not need to be limited for this duration).
Internal structures will hold the input voltage above –1.0 V if the injection current limit of 2 mA is met.
Internal structures hold the input voltage below this maximum voltage on all pads powered by V
injection current specification is met (25 mA for all pins) and V
Total injection current for all pins (including both digital and analog) must not exceed 25 mA.
Total injection current for all analog input pins must not exceed 15 mA.
Solder profile per CDF-AEC-Q100.
Moisture sensitivity per JEDEC test method A112.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method (MIL
SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature.
Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2.
DDEx
1
2
3
4
5
6
7
are separate power segments and may be powered independently with no differential voltage constraints between the
Junction to Ambient
Junction to Ambient
Junction to Ambient
Junction to Ambient
Junction to Board
Junction to Case
Junction to Package Top
Thermal characteristics
Natural Convection
(Single layer board)
Natural Convection
(Four layer board 2s2p)
(@200 ft./min., Single layer board)
(@200 ft./min., Four layer board 2s2p)
Natural Convection
General notes for specifications at maximum junction temperature
5
4
1, 2
1, 3
1, 3
1, 3
Characteristic
6
PXN20 Microcontroller Data Sheet, Rev. 1
Table 6. Thermal characteristics
T
J
J
, can be obtained from the equation:
= T
A
+ (R
JA
DDE
 P
Symbol
is within Operating Voltage specifications.
R
R
D
R
R
R
R

JMA
JMA
)
JA
JA
JB
JC
JT
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
208 MAPBGA
39
24
31
20
13
6
2
DDE
Electrical characteristics
supplies, if the maximum
Value
256 MAPBGA
39
24
31
20
13
6
2
Eqn. 1
27