MPC8308VMAFDA Freescale Semiconductor, MPC8308VMAFDA Datasheet - Page 59

• Manufacturer Part Number: MPC8308VMAFDA
• Description: Microprocessors - MPU E300 MP PbFr 333
• Manufacturer: Freescale Semiconductor

Specifications of MPC8308VMAFDA

• Rohs: yes
• Processor Series: MPC8308
• Core: e300
• Maximum Clock Frequency: 333 MHz
• Interface Type: I2C, JTAG, UART
• Operating Supply Voltage: 0.95 V to 1.05 V
• Maximum Operating Temperature: 0 C to + 105 C
• Mounting Style: SMD/SMT
• Package / Case: MAPBGA-473

This figure shows the SPI timing in slave mode (external clock).
This figure shows the SPI timing in master mode (internal clock).
20 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions. The MPC8308 is available in
a moulded array process ball grid array (MAPBGA). For information on the MAPBGA, see
“Package Parameters for the MPC8308 MAPBGA,”
MPC8308 MAPBGA.”
20.1
The package parameters are as provided in the following list. The package type is 19 mm  19 mm, 473
MAPBGA.
Freescale Semiconductor
Package outline
Interconnects
Pitch
Module height (typical)
Solder Balls
Ball diameter (typical)
Note: The clock edge is selectable on SPI.
Note: The clock edge is selectable on SPI.
Package Parameters for the MPC8308 MAPBGA
SPICLK (output)
Output Signals:
Output Signals:
SPICLK (input)
Input Signals:
Input Signals:
(See Note)
(See Note)
(See Note)
(See Note)
SPIMOSI
SPIMISO
SPIMISO
SPIMOSI
Figure 51. SPI AC Timing in Master Mode (Internal Clock) Diagram
Figure 50. SPI AC Timing in Slave Mode (External Clock) Diagram
MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3
t
NEIVKH
t
NIIVKH
t
NIKHOV
19 mm 19 mm
473
0.80 mm
1.39 mm
96.5 Sn/ 3.5Ag
0.40 mm
t
NIIXKH
t
NEKHOV
t
NEIXKH
and
Section 20.2, “Mechanical Dimensions of the
Package and Pin Listings
Section 20.1,
59