MK20DN512VLL10 Freescale Semiconductor, MK20DN512VLL10 Datasheet - Page 22

• Manufacturer Part Number: MK20DN512VLL10
• Description: ARM Microcontrollers - MCU Kinetis 512K
• Manufacturer: Freescale Semiconductor

Specifications of MK20DN512VLL10

• Rohs: yes
• Core: ARM Cortex M4
• Processor Series: MK20DN512
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 100 MHz
• Program Memory Size: 512 KB
• Data Ram Size: 128 KB
• On-chip Adc: Yes
• Operating Supply Voltage: 1.71 V to 3.6 V
• Operating Temperature Range: - 40 C to + 105 C
• Package / Case: LQFP-100
• Mounting Style: SMD/SMT
• A/d Bit Size: 16 bit
• A/d Channels Available: 2
• Interface Type: CAN, I2C, I2S, SPI, UART, USB
• Maximum Operating Temperature: + 105 C
• Minimum Operating Temperature: - 40 C
• Number Of Timers: 2
• On-chip Dac: Yes
• Program Memory Type: Flash
• Supply Voltage - Max: 3.6 V
• Supply Voltage - Min: 1.71 V

Peripheral operating requirements and behaviors
1.
2.
3.
4.
6 Peripheral operating requirements and behaviors
6.1 Core modules
6.1.1 Debug trace timing specifications
22
—
Board type
Symbol
T
T
T
T
T
T
T
cyc
wh
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method
Environmental Conditions—Forced Convection (Moving Air).
Determined according to JEDEC Standard JESD51-8, Integrated Circuit Thermal Test Method Environmental
Conditions—Junction-to-Board.
Determined according to Method 1012.1 of MIL-STD 883, Test Method Standard, Microcircuits, with the cold plate
temperature used for the case temperature. The value includes the thermal resistance of the interface material
between the top of the package and the cold plate.
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air).
wl
s
h
r
f
Clock period
Low pulse width
High pulse width
Clock and data rise time
Clock and data fall time
Data setup
Data hold
Description
Ψ
Symbol
JT
Table 12. Debug trace operating behaviors
Figure 3. TRACE_CLKOUT specifications
K20 Sub-Family Data Sheet, Rev. 2, 12/2012.
Thermal
characterization
parameter, junction
to package top
outside center
(natural
convection)
Description
2
100 LQFP
Frequency dependent
Min.
°C/W
Unit
—
—
2
2
3
2
Freescale Semiconductor, Inc.
Max.
—
—
—
—
3
3
4
Notes
MHz
Unit
ns
ns
ns
ns
ns
ns