LPC11E11FHN33/101, NXP Semiconductors, LPC11E11FHN33/101, Datasheet - Page 53

no-image

LPC11E11FHN33/101,

Manufacturer Part Number
LPC11E11FHN33/101,
Description
ARM Microcontrollers - MCU 8kB 512B EE 4kB SRAM
Manufacturer
NXP Semiconductors
Datasheet

Specifications of LPC11E11FHN33/101,

Rohs
yes
Core
ARM Cortex M0
Processor Series
LPC11E1x
Data Bus Width
32 bit
Maximum Clock Frequency
50 MHz
Program Memory Size
8 KB
Data Ram Size
512 B
On-chip Adc
Yes
Operating Supply Voltage
3.3 V
Operating Temperature Range
- 40 C to + 85 C
Package / Case
HVQFN-33
Mounting Style
SMD/SMT
Factory Pack Quantity
260
NXP Semiconductors
Fig 31. Package outline LQFP64 (SOT314-2)
LPC11E1X
Product data sheet
LQFP64: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT314-2
max.
1.6
A
49
64
y
48
0.20
0.05
A
1
1
e
1.45
1.35
A
2
pin 1 index
136E10
IEC
0.25
A
b
3
p
H
D
D
0.27
0.17
b
p
w
M
0.18
0.12
c
X
All information provided in this document is subject to legal disclaimers.
MS-026
JEDEC
10.1
D
9.9
16
Z D
33
(1)
REFERENCES
17
Rev. 1 — 20 February 2012
32
10.1
E
9.9
(1)
Z E
0
b
B
0.5
e
w
p
e
v
M
v
M
JEITA
scale
12.15
11.85
2.5
M
H
B
D
A
A
E
12.15
11.85
H
H
E
E
5 mm
L
1
A
0.75
0.45
L
A
32-bit ARM Cortex-M0 microcontroller
p
2
A
1
0.2
v
0.12
w
PROJECTION
EUROPEAN
detail X
0.1
y
Z
1.45
1.05
D
LPC11E1x
(1)
L
© NXP B.V. 2012. All rights reserved.
Z
1.45
1.05
L
E
p
ISSUE DATE
(1)
00-01-19
03-02-25
(A )
7
0
θ
3
SOT314-2
o
o
θ
53 of 61

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