STM32F372VBT6 STMicroelectronics, STM32F372VBT6 Datasheet - Page 98

• Manufacturer Part Number: STM32F372VBT6
• Description: ARM Microcontrollers - MCU 32-Bit ARM Cortex M4 72MHz 128kB MCU FPU
• Manufacturer: STMicroelectronics

Specifications of STM32F372VBT6

• Product Category: ARM Microcontrollers - MCU
• Rohs: yes
• Core: ARM Cortex M4F
• Processor Series: STM32F372xx
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 72 MHz
• Program Memory Size: 128 KB
• Data Ram Size: 24 KB
• On-chip Adc: Yes
• Operating Supply Voltage: 2.4 V to 3.6 V
• Operating Temperature Range: - 40 C to + 85 C
• Package / Case: LQFP-100
• Mounting Style: SMD/SMT
• A/d Bit Size: 16 bit
• A/d Channels Available: 1
• Interface Type: CAN, I2C, SPI, USART, USB
• Length: 14 mm
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Number Of Programmable I/os: 84
• Number Of Timers: 2
• On-chip Dac: Yes
• Program Memory Type: Flash
• Supply Voltage - Max: 3.6 V
• Supply Voltage - Min: 2.4 V

Electrical characteristics
Figure 29. ADC accuracy characteristics
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4095
4094
4093
7
6
5
4
3
2
1
0
V
SSA
1
E
2. ADC accuracy vs. negative injection current: Injecting a negative current on any analog input pins should
3. Better performance may be achieved in restricted V
4. Data based on characterization results, not tested in production.
Figure 30. Typical connection diagram using the ADC
1. Refer to
2. C
General PCB design guidelines
Power supply decoupling should be performed as shown in
should be ceramic (good quality) and it should be placed as close as possible to the chip.
O
1 LSB
2
be avoided as this significantly reduces the accuracy of the conversion being performed on another analog
input. It is recommended to add a Schottky diode (pin to ground) to analog pins which may potentially inject
negative currents.
Any positive injection current within the limits specified for I
affect the ADC accuracy.
pad capacitance (roughly 7 pF). A high C
this, f
parasitic
IDEAL
3
ADC
Table 60
represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the
should be reduced.
4
V
DDA
5
1 LSB
for the values of R
E
6
T
C parasitic
IDEAL
E
7
L
AINx
(2)
Doc ID 022691 Rev 3
E
D
SRC
4093 4094 4095 4096
(3)
V DD
, R
parasitic
ADC
0.6 V
0.6 V
V T
V T
(1)
and C
value will downgrade conversion accuracy. To remedy
E
DDA
G
ADC
V
DDA
, frequency and temperature ranges.
I L ±1 μA
.
INJ(PIN)
(1) Example of an actual transfer curve
(2) The ideal transfer curve
(3) End point correlation line
E
between the actual and the ideal transfer curves.
E
transition and the first ideal one.
E
transition and the last actual one.
E
between actual steps and the ideal one.
E
between any actual transition and the end point
correlation line.
T
O
G
D
L
=Total Unadjusted Error: maximum deviation
=Integral Linearity Error: maximum deviation
=Differential Linearity Error: maximum deviation
=Offset Error: deviation between the first actual
=Gain Error: deviation between the last ideal
and I
R ADC (1)
Sample and hold ADC
converter
Figure
INJ(PIN)
C ADC (1)
9. The 10 nF capacitor
in
converter
Section 6.3.14
12-bit
STM32F37x
does not