SSTUH32864EC,557 NXP Semiconductors, SSTUH32864EC,557 Datasheet - Page 2

IC BUFFER 1.8V 1/14BIT SOT536-1

SSTUH32864EC,557

Manufacturer Part Number
SSTUH32864EC,557
Description
IC BUFFER 1.8V 1/14BIT SOT536-1
Manufacturer
NXP Semiconductors
Datasheet

Specifications of SSTUH32864EC,557

Logic Type
1:2 Configurable Registered Buffer
Supply Voltage
1.7 V ~ 1.9 V
Number Of Bits
25, 14
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
96-LFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
935277951557
SSTUH32864EC
SSTUH32864EC
Philips Semiconductors
2. Features
3. Ordering information
Table 1:
T
9397 750 14137
Product data sheet
Type number
SSTUH32864EC/G Pb-free (SnAgCu
SSTUH32864EC
amb
= 0 C to +70 C.
Ordering information
Solder process
solder ball compound)
SnPb solder ball
compound
The SSTUH32864 is identical to SSTU32864 in function and performance, with
higher-drive outputs optimized to drive heavy load nets (such as stacked DRAMs) while
maintaining speed and signal integrity.
Configurable register supporting DDR2 Registered DIMM applications
Higher output drive strength version of SSTU32864 optimized for high-capacitive load
nets
Configurable to 25-bit 1 : 1 mode or 14-bit 1 : 2 mode
Controlled output impedance drivers enable optimal signal integrity and speed
Exceeds JESD82-7 speed performance (1.8 ns max. single-bit switching propagation
delay; 2.0 ns max. mass-switching)
Supports up to 450 MHz clock frequency of operation
Optimized pinout for high-density DDR2 module design
Chip-selects minimize power consumption by gating data outputs from changing state
Supports SSTL_18 data inputs
Differential clock (CK and CK) inputs
Supports LVCMOS switching levels on the control and RESET inputs
Single 1.8 V supply operation
Available in 96-ball, 13.5
Package
Name
LFBGA96
LFBGA96
Rev. 01 — 22 April 2005
5.5 mm, 0.8 mm ball pitch LFBGA package
Description
plastic low profile fine-pitch ball grid array package;
96 balls; body 13.5
plastic low profile fine-pitch ball grid array package;
96 balls; body 13.5
1.8 V high output drive DDR registered buffer
5.5
5.5
1.05 mm
1.05 mm
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
SSTUH32864
Version
SOT536-1
SOT536-1
2 of 20

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