SSTU32866EC,557 NXP Semiconductors, SSTU32866EC,557 Datasheet - Page 2

IC BUFFER 1.8V 25BIT SOT536-1

SSTU32866EC,557

Manufacturer Part Number
SSTU32866EC,557
Description
IC BUFFER 1.8V 25BIT SOT536-1
Manufacturer
NXP Semiconductors
Datasheet

Specifications of SSTU32866EC,557

Logic Type
1:1, 1:2 Configurable Registered Buffer with Parity
Supply Voltage
1.7 V ~ 1.9 V
Number Of Bits
25, 14
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
96-LFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
935275071557
SSTU32866EC
SSTU32866EC
Philips Semiconductors
3. Applications
4. Ordering information
Table 1:
T
9397 750 14181
Product data sheet
Type number
SSTU32866EC/G Pb-free (SnAgCu solder
SSTU32866EC
amb
= 0 C to +70 C.
Ordering information
Solder process
ball compound)
SnPb solder ball
compound
DDR2 registered DIMMs desiring parity checking functionality
Package
Name
LFBGA96
LFBGA96
Rev. 02 — 11 November 2004
Description
plastic low profile fine-pitch ball grid array package;
96 balls; body 13.5
plastic low profile fine-pitch ball grid array package;
96 balls; body 13.5
1.8 V DDR2 configurable registered buffer with parity
5.5
5.5
1.05 mm
1.05 mm
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
SSTU32866
Version
SOT536-1
SOT536-1
2 of 29

Related parts for SSTU32866EC,557