MC56F8035VLDR Freescale Semiconductor, MC56F8035VLDR Datasheet - Page 130

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MC56F8035VLDR

Manufacturer Part Number
MC56F8035VLDR
Description
Digital Signal Processors & Controllers - DSP, DSC 16 BIT DSPHC 64KB
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MC56F8035VLDR

Rohs
yes
Core
56800E
Data Bus Width
16 bit
Program Memory Size
64 KB
Data Ram Size
8 KB
Maximum Clock Frequency
32 MHz
Number Of Programmable I/os
35
Number Of Timers
3
Device Million Instructions Per Second
32 MIPs
Operating Supply Voltage
3 V to 3.6 V
Maximum Operating Temperature
+ 105 C
Package / Case
LQFP-44
Mounting Style
SMD/SMT

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Part Number:
MC56F8035VLDR
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10.4 Flash Memory Characteristics
10.5 External Clock Operation Timing
130
1. There is additional overhead which is part of the programming sequence. See the 56F802x and 56F803x Peripheral
2. Specifies page erase time. There are 512 bytes per page in the Program Flash memory.
1. Parameters listed are guaranteed by design.
2. See
3. The chip may not function if the high or low pulse width is smaller than 6.25ns.
4. External clock input rise time is measured from 10% to 90%.
5. External clock input fall time is measured from 90% to 10%.
Characteristic
Program time
Erase time
Mass erase time
Frequency of operation (external clock driver)
Clock Pulse Width
External Clock Input Rise Time
External Clock Input Fall Time
Reference Manual for details.
External
Note: The midpoint is V
Clock
Figure 10-4
2
1
Table 10-10 External Clock Operation Timing Requirements
Characteristic
for details on using the recommended connection of an external clock driver.
3
10%
50%
90%
t
PW
IL
+ (V
5
4
Figure 10-4 External Clock Timing
IH
Table 10-9 Flash Timing Parameters
– V
56F8035/56F8025 Data Sheet, Rev. 6
IL
)/2.
Symbol
T
T
T
erase
prog
2
t
me
PW
Symbol
f
t
t
t
osc
PW
rise
fall
Min
100
20
20
6.25
Min
4
t
fall
Typ
Typ
8
Max
40
t
rise
Max
Freescale Semiconductor
8
3
3
1
10%
50%
90%
MHz
V
V
Unit
Unit
ms
ms
ns
ns
ns
IH
IL
s

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