SSTU32864EC/G,557 NXP Semiconductors, SSTU32864EC/G,557 Datasheet - Page 2

• Manufacturer Part Number: SSTU32864EC/G,557
• Description: IC 25BIT CONFIG REG BUFF 96LFBGA
• Manufacturer: NXP Semiconductors

Specifications of SSTU32864EC/G,557

• Logic Type: 1:1, 1:2 Configurable Registered Buffer
• Supply Voltage: 1.7 V ~ 1.9 V
• Number Of Bits: 25, 14
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 96-LFBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 568-2052; 935275429557; SSTU32864EC/G

Philips Semiconductors
2. Features
3. Ordering information
Table 1:
T
9397 750 14092
Product data sheet
Type number
SSTU32864EC/G Pb-free (SnAgCu
SSTU32864EC
amb
= 0 C to +70 C.
Ordering information
Solder process
solder ball compound)
SnPb solder ball
compound
Configurable register supporting DDR2 Registered DIMM applications
Configurable to 25-bit 1:1 mode or 14-bit 1:2 mode
Controlled output impedance drivers enable optimal signal integrity and speed
Exceeds JESD82-7 speed performance (1.8 ns max. single-bit switching propagation
delay; 2.0 ns max. mass-switching)
Supports up to 450 MHz clock frequency of operation
Optimized pinout for high-density DDR2 module design
Chip-selects minimize power consumption by gating data outputs from changing state
Supports SSTL_18 data inputs
Differential clock (CK and CK) inputs
Supports LVCMOS switching levels on the control and RESET inputs
Single 1.8 V supply operation
Available in 96-ball, 13.5
Package
Name
LFBGA96
LFBGA96
1.8 V configurable registered buffer for DDR2 RDIMM applications
Rev. 02 — 22 October 2004
5.5 mm, 0.8 mm ball pitch LFBGA package
Description
plastic low profile fine-pitch ball grid array package;
96 balls; body 13.5
plastic low profile fine-pitch ball grid array package;
96 balls; body 13.5
5.5
5.5
1.05 mm
1.05 mm
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
SSTU32864
Version
SOT536-1
SOT536-1
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