MT47H64M16HR-37E:E Micron, MT47H64M16HR-37E:E Datasheet

MT47H64M16HR-37E:E

Manufacturer Part Number

MT47H64M16HR-37E:E

Description

mt47h64m16hr-37e:e 1gb dd r2 sdram component rohs...

Manufacturer

Micron

Datasheet

1.MT47H64M16HR-37EE.pdf (135 pages)

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DDR2 SDRAM

MT47H256M4 – 32 Meg x 4 x 8 banks

MT47H128M8 – 16 Meg x 8 x 8 banks

MT47H64M16 – 8 Meg x 16 x 8 banks

Features

• Vdd = +1.8V ±0.1V, VddQ = +1.8V ±0.1V

• JEDEC-standard 1.8V I/O (SSTL_18-compatible)

• Differential data strobe (DQS, DQS#) option

• 4n-bit prefetch architecture

• Duplicate output strobe (RDQS) option for x8

• DLL to align DQ and DQS transitions with CK

• 8 internal banks for concurrent operation

• Programmable CAS latency (CL)

• Posted CAS additive latency (AL)

• WRITE latency = READ latency - 1

• Selectable burst lengths (BL): 4 or 8

• Adjustable data-output drive strength

• 64ms, 8,192-cycle refresh

• On-die termination (ODT)

• Industrial temperature (IT) option

• RoHS compliant

• Supports JEDEC clock jitter specification

PDF: 09005aef821ae8bf

Rev. O 9/08 EN

Products and specifications discussed herein are subject to change by Micron without notice.

Options

• Configuration

• FBGA package (Pb-free) – x16

• FBGA package (Pb-free) – x4, x8

• FBGA package (lead solder) – x16

• FBGA package (lead solder) – x4, x8

• Timing – cycle time

• Self refresh

• Operating temperature

• Revision

– 256 Meg x 4 (32 Meg x 4 x 8 banks)

– 128 Meg x 8 (16 Meg x 8 x 8 banks)

– 64 Meg x 16 (8 Meg x 16 x 8 banks)

– 84-ball FBGA (8mm x 12.5mm) Rev. E, G

– 60-ball FBGA (8mm x 11.5mm) Rev. E, G

– 84-ball FBGA (8mm x 12.5mm) Rev. E, G

– 60-ball FBGA (8mm x 11.5mm) Rev. E, G

– 1.875ns @ CL = 7 (DDR2-1066)

– 2.5ns @ CL = 5 (DDR2-800)

– 2.5ns @ CL = 6 (DDR2-800)

– 3.0ns @ CL = 4 (DDR2-667)

– 3.0ns @ CL = 5 (DDR2-667)

– 3.75ns @ CL = 4 (DDR2-533)

– 5.0ns @ CL = 3 (DDR2-400)

– Standard

– Low-power

– Commercial (0°C ≤ T

– Industrial (–40°C ≤ T

– Automotive (–40°C ≤ T

Note:

–40°C ≤ T

Micron Technology, Inc. reserves the right to change products or specifications without notice.

1. Not all options listed can be combined to

define an offered product. Use the Part

Catalog Search on

product offerings and availability.

1Gb: x4, x8, x16 DDR2 SDRAM

≤ 85°C)

≤ 95°C;

, T

www.micron.com

≤ 105ºC)

Features

Marking

256M4

128M8

64M16

for

-187E

None

:E/:G

-25E

-37E

-3E

-5E

-25

-3

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