LPC2138FBD64/01-S NXP Semiconductors, LPC2138FBD64/01-S Datasheet - Page 35

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LPC2138FBD64/01-S

Manufacturer Part Number
LPC2138FBD64/01-S
Description
Ic
Manufacturer
NXP Semiconductors
Datasheet
NXP Semiconductors
Fig 14. Package outline SOT804-2 (HVQFN64)
LPC2131_32_34_36_38_4
Product data sheet
HVQFN64: plastic thermal enhanced very thin quad flat package; no leads; 64 terminals;
body 9 x 9 x 0.85 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
VERSION
OUTLINE
SOT804-2
max.
terminal 1
index area
terminal 1
index area
A
1
L
E h
0.05
0.00
A
1
16
e
1
17
0.80
0.65
64
A
4
- - -
IEC
0.30
0.18
b
1/2
0.2
e
c
D 1
D h
e 1
D
9.05
8.95
D
MO-220
JEDEC
0
8.95
8.55
D
REFERENCES
1
Rev. 04 — 16 October 2007
b
7.25
6.95
D
h
49
32
9.05
8.95
E
JEITA
33
48
- - -
1/2
E 1 E
B
e
8.95
8.55
w
e
E
v
scale
1
A
M
M
5
e 2
C
C
7.25
6.95
E
h
A
B
LPC2131/32/34/36/38
0.5
e
A
Single-chip 16/32-bit microcontrollers
7.5
e
A 4
1
A 1
y 1 C
10 mm
7.5
e
2
PROJECTION
EUROPEAN
0.5
0.3
detail X
L
0.1
v
X
C
y
0.05
© NXP B.V. 2007. All rights reserved.
w
ISSUE DATE
04-03-25
0.05
c
y
SOT804-2
0.1
y
1
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