BC807W T/R NXP Semiconductors, BC807W T/R Datasheet
BC807W T/R
Related parts for BC807W T/R
BC807W T/R Summary of contents
Page 1
BC807; BC807W; BC327 45 V, 500 mA PNP general-purpose transistors Rev. 05 — 21 February 2005 1. Product profile 1.1 General description PNP general-purpose transistors. Table 1: Type number BC807 BC807W [1] BC327 [1] Also available in SOT54A and SOT54 ...
Page 2
Philips Semiconductors 2. Pinning information Table 3: Pin SOT23 SOT323 SOT54 SOT54A SOT54 variant 9397 750 14023 Product data sheet BC807; BC807W; BC327 45 V, ...
Page 3
Philips Semiconductors 3. Ordering information Table 4: Type number BC807 BC807W [2] BC327 [1] Valid for all available selection groups. [2] Also available in SOT54A and SOT54 variant packages (see 4. Marking Table 5: Type number BC807 BC807-16 BC807-25 BC807-40 ...
Page 4
Philips Semiconductors 5. Limiting values Table 6: In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol V CBO V CEO V EBO tot T stg amb [1] Transistor ...
Page 5
Philips Semiconductors 7. Characteristics Table 8: Characteristics unless otherwise specified. amb Symbol Parameter I collector-base cut-off current CBO I emitter-base cut-off current EBO h DC current gain FE BC807; BC807W; BC327 BC807-16; BC807-16W; BC327-16 BC807-25; BC807-25W; ...
Page 6
Philips Semiconductors 300 ( 200 (2) 100 ( ( 150 C. amb ( amb ( amb Fig 1. ...
Page 7
Philips Semiconductors 10 V BEsat (V) 1 (1) ( amb ( amb ( 150 C. amb ...
Page 8
Philips Semiconductors 1 V CEsat ( ( 150 C. amb ( amb ( amb ...
Page 9
Philips Semiconductors 1 (A) 0.8 0 amb ( 16.0 mA 14.4 mA 12.8 mA 11.2 mA. ...
Page 10
Philips Semiconductors amb ( 12.0 mA 10.8 mA 9.6 mA 8.4 mA 7.2 mA ...
Page 11
Philips Semiconductors 8. Package outline Plastic surface mounted package; 3 leads DIMENSIONS (mm are the original dimensions UNIT max. 1.1 0.48 0.15 mm 0.1 0.9 0.38 0.09 OUTLINE VERSION IEC SOT23 Fig ...
Page 12
Philips Semiconductors Plastic surface mounted package; 3 leads DIMENSIONS (mm are the original dimensions UNIT b p max 1.1 0.4 0.25 mm 0.1 0.8 0.3 0.10 OUTLINE VERSION IEC SOT323 Fig 14. Package ...
Page 13
Philips Semiconductors Plastic single-ended leaded (through hole) package; 3 leads DIMENSIONS (mm are the original dimensions) UNIT 5.2 0.48 0.66 0.45 mm 5.0 0.40 0.55 0.38 Note ...
Page 14
Philips Semiconductors Plastic single-ended leaded (through hole) package; 3 leads (wide pitch DIMENSIONS (mm are the original dimensions) UNIT 5.2 0.48 0.66 0.45 mm 5.0 0.40 0.55 ...
Page 15
Philips Semiconductors Plastic single-ended leaded (through hole) package; 3 leads (on-circle DIMENSIONS (mm are the original dimensions) UNIT 5.2 0.48 0.66 0.45 mm 5.0 0.40 0.55 0.38 ...
Page 16
Philips Semiconductors 9. Packing information Table 9: Packing methods The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package BC807 SOT23 BC807W SOT323 BC327 SOT54 BC327 SOT54A BC327 SOT54A BC327 SOT 54 variant [1] ...
Page 17
Philips Semiconductors 10. Revision history Table 10: Revision history Document ID Release date BC807_BC807W_ 20050221 BC327_5 • Modifications: The format of the data sheet has been redesigned to comply with the new presentation and information standard of Philips Semiconductors. • ...
Page 18
Philips Semiconductors 11. Data sheet status [1] Level Data sheet status Product status I Objective data Development II Preliminary data Qualification III Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. ...
Page 19
Philips Semiconductors 15. Contents 1 Product profi 1.1 General description ...