LTC3026EMSE-1#PBF Linear Technology, LTC3026EMSE-1#PBF Datasheet - Page 16

• Manufacturer Part Number: LTC3026EMSE-1#PBF
• Description: 1.5a vldo in dfn... ic reg ldo adj 1.5a...
• Manufacturer: Linear Technology

LTC3026
package DescripTion
Please refer to
16
3.55 ±0.05
http://www.linear.com/designtools/packaging/
2.15 ±0.05
(SEE NOTE 6)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
TOP MARK
0.25 ±0.05
1.65 ±0.05
(2 SIDES)
PIN 1
0.200 REF
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
TOP AND BOTTOM OF PACKAGE
2.38 ±0.05
(2 SIDES)
0.50
BSC
(Reference LTC DWG # 05-08-1699 Rev C)
10-Lead Plastic DFN (3mm × 3mm)
3.00 ±0.10
0.75 ±0.05
0.70 ±0.05
(4 SIDES)
PACKAGE
OUTLINE
0.00 – 0.05
DD Package
for the most recent package drawings.
1.65 ±0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
5
R = 0.125
6
2.38 ±0.10
(2 SIDES)
TYP
10
1
0.50 BSC
0.25 ±0.05
0.40 ±0.10
(DD) DFN REV C 0310
PIN 1 NOTCH
R = 0.20 OR
0.35 × 45°
CHAMFER
3026ff