LTC3026EMSE-1#PBF Linear Technology, LTC3026EMSE-1#PBF Datasheet - Page 15

• Manufacturer Part Number: LTC3026EMSE-1#PBF
• Description: 1.5a vldo in dfn... ic reg ldo adj 1.5a...
• Manufacturer: Linear Technology

package DescripTion
Please refer to
http://www.linear.com/designtools/packaging/
(.0120 ±.0015)
GAUGE PLANE
0.305 ± 0.038
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
6. EXPOSED PAD DIMENSION DOES INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
SHALL NOT EXCEED 0.254mm (.010") PER SIDE.
TYP
(.007)
RECOMMENDED SOLDER PAD LAYOUT
0.18
(.206)
5.23
MIN
(.010)
0.254
(.074 ±.004)
1.88 ±0.102
DETAIL “A”
DETAIL “A”
(.066 ±.004)
1.68 ±0.102
(.0197)
0.50
BSC
0° – 6° TYP
10-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1664 Rev H)
(.021 ±.006)
0.53 ±0.152
0.889 ±0.127
(.035 ±.005)
(.126 – .136)
3.20 – 3.45
SEATING
PLANE
MSE Package
for the most recent package drawings.
(.118 ±.004)
3.00 ±0.102
(.007 – .011)
0.17 – 0.27
(.193 ±.006)
(NOTE 3)
4.90 ±0.152
TYP
(.043)
1.10
MAX
EXPOSED PAD OPTION
(.0197)
BOTTOM VIEW OF
0.50
BSC
10
10
1
1 2 3 4 5
9
8
7 6
DETAIL “B”
(.074)
1.88
(.118 ±.004)
3.00 ±0.102
(.034)
0.497 ±0.076
(.0196 ±.003)
(NOTE 4)
0.86
REF
0.1016 ±0.0508
(.066)
MSOP (MSE) 0911 REV H
1.68
(.004 ±.002)
REF
NO MEASUREMENT PURPOSE
THE LEADFRAME FEATURE.
CORNER TAIL IS PART OF
FOR REFERENCE ONLY
DETAIL “B”
0.05 REF
0.29
REF
LTC3026
15
3026ff