FMM5057X EUDYNA [Eudyna Devices Inc], FMM5057X Datasheet - Page 11

• Manufacturer Part Number: FMM5057X
• Description: C-Band Power Amplifier MMIC
• Manufacturer: EUDYNA [Eudyna Devices Inc]

RF-IN
■ ■ ■ ■ Chip Outline and Bonding Pad Locations (Dimension in Micro-Meters)
3230
3105
3075
1618
128
0
0
0
VDD1
VGG
737
737
VDD2
1204
1204
VDD4
VDD3
2000
2000
11
Chip Size : 4130± ± ± ± 30um x 3230± ± ± ± 30um
Chip Thickness : 70± ± ± ± 20um
Bonding Pad Size :
RF-Pad : 120um x 240um
VDD Pad : 240um x 120um
VGG Pad : 120um x 120um
C-Band Power Amplifier MMIC
VDD5
VDD6
3545
3545
FMM5057X
4130
4130
3230
3105
3075
1618
128
0
RF-OUT