HBCR-1611 Agilent(Hewlett-Packard), HBCR-1611 Datasheet - Page 6

• Manufacturer Part Number: HBCR-1611
• Description: Single Chip Bar Code Decode IC
• Manufacturer: Agilent(Hewlett-Packard)

4-42
Surface Mount IC Drying
Whenever Vapor Phase or Infra-
red Reflow technologies are used
to mount either of the surface
mount packages, there is a possi-
bility that previously absorbed
moisture, heated very rapidly to
the reflow temperatures, may
cause the package to crack from
internal stresses. There is a
reliability concern that moisture
may then enter the package over
a period of time, and metal
corrosion may take place,
degrading the IC performance.
Stand Alone Decoder
(Parallel Mode)
2N5088
150
+5 V
SDI
10 K
47 K
+5 V
EX3
C3C
I2C
CST
UEE
UE1
FRQ
CSS
GRB
U5S
U2S
LED
SDI
XTAL 1
XTAL 2
HBCR-161X
DWR
CRD
PGB
GND
BPR
CDY
DDY
PDR
V
RST
RTS
PP7
PP6
PP5
PP4
PP3
PP2
PP1
PP0
IOM
WR
RD
EA
CC
To reduce the amount of
absorbed moisture and prevent
cracking, all of the surface mount
ICs should undergo one of the
following baking cycles. The
parts MUST then be mounted
within 48 hours. If the parts are
not mounted within 48 hours,
they must be rebaked.
The total number of baking cycles
must not exceed two (2). If the
ICs are baked more than twice,
Hewlett-Packard cannot guaran-
tee the performance and
reliability of the parts.
10 K
10 µF
1N4148
23
21
11
10
0.047 µF
+5 V
1
3
9
8
7
6
5
4
CAB
CBA
DIR
G
A8
A7
A6
A5
A4
A3
A2
A1
74HCT646
+5 V
2N2907
500
10
mH
SBA
SAB
10
V
V
CC
SS
B8
B7
B6
B5
B4
B3
B2
B1
13
14
15
16
17
18
19
20
24
22
2
12
+5 V
1N4148
PIEZO
BEEPER
CRD
CDY
DWR
DDY
RTS
+5 V
D8
D7
D6
D5
D4
D3
D2
D1
NOTES:
1. USE THE CORRECT CAPACITOR FOR
2. SEE PIN DIAGRAMS FOR THE PINOUT
3. VOLUME OF THE BEEPER CIRCUIT IS
4. AN ALTERNATIVE CIRCUIT USING TWO
5. THE LOGIC LEVELS OF THE SDI SCANNER
EITHER A CRYSTAL OR A CERAMIC
RESONATOR. SEE THE USERS MANUAL.
OF THE DECODE IC. PIN NUMBERS VARY
WITH PACKAGE.
ADJUSTABLE BY VARYING THE VALUE
OF THE 500
74HCT574 OCTAL LATCHES INSTEAD OF
THE 74HCT646 IS IN THE USERS MANUAL.
INPUT IS AS FOLLOWS: BLACK = HIGH,
WHITE = LOW.
Neither bake cycle can be per-
formed in the standard shipping
tubes. The ICs must be baked in
an ESD safe, mechanically stable
container, such as an aluminum
tube or pan.
Note: Cycle B must be done in an
atmosphere of <5% relative humidity air
or nitrogen.
Cycle
A
B
POT.
Temper-
125 C
ature
60 C
24 Hours
96 Hours
Time