EMIF06-1502M12_08 STMICROELECTRONICS [STMicroelectronics], EMIF06-1502M12_08 Datasheet - Page 6

• Manufacturer Part Number: EMIF06-1502M12_08
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

Recommendation on PCB assembly
4
4.1
6/10
Recommendation on PCB assembly
Stencil opening design
1.
Figure 12. Stencil opening dimensions
2.
Figure 13. Recommended stencil window position
General recommendation on stencil opening design
a)
b)
Reference design
a)
b)
c)
400 µm
Stencil opening dimensions: L (Length), W (Width), T (Thickness).
General design rule
Stencil thickness (T) = 75 ~ 125 µm
Stencil opening thickness: 100 µm
Stencil opening for central exposed pad: Opening to footprint ratio is 50%.
Stencil opening for leads: Opening to footprint ratio is 90%.
Aspect Ratio
Aspect Area
288 µm
5 µm
190 µm
200 µm
1800 µm
=
=
1224 µm
W
---- -
--------------------------- -
2T L
T
5 µm
L
≥
(
×
1.5
+
W
15 µm
15 µm
W
)
L
≥
288 µm
0.66
T
50 µm
50 µm
W
0.40
0.40
Footprint
Stencil window
Footprint
1.80
EMIF06-1502M12
0.20
0.60
0.25
2.10