HMC572_09 HITTITE [Hittite Microwave Corporation], HMC572_09 Datasheet - Page 5
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HMC572_09
Manufacturer Part Number
HMC572_09
Description
GaAs MMIC I/Q DOWNCONVERTER 24 - 28 GHz
Manufacturer
HITTITE [Hittite Microwave Corporation]
Datasheet
1.HMC572_09.pdf
(8 pages)
3 - 150
3
Outline Drawing
Die Packaging Information
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
GP-1 (Gel Pack)
Standard
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Alternate
v02.0809
[1]
[2]
Order On-line at www.hittite.com
GaAs MMIC I/Q DOWNCONVERTER
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM]
2. DIE THICKNESS IS 0.004”
3. BOND PAD METALIZATION: GOLD
4. BACKSIDE METALIZATION: GOLD
5. BACKSIDE METAL IS GROUND
6. OVERALL DIE SIZE ±0.002
24 - 28 GHz
HMC572