HMC562_08 HITTITE [Hittite Microwave Corporation], HMC562_08 Datasheet
HMC562_08
Related parts for HMC562_08
HMC562_08 Summary of contents
Page 1
Typical Applications 2 The HMC562 wideband driver is ideal for: • Military & Space • Test Instrumentation • Fiber Optics Functional Diagram Electrical Specifi cations, Parameter Frequency Range Gain Gain Flatness Gain Variation Over Temperature Input Return Loss Output Return ...
Page 2
Gain & Return Loss S21 S11 S22 0 -5 -10 -15 -20 - FREQUENCY (GHz) Input Return Loss vs. Temperature 0 +25C -5 +85C -55C -10 -15 -20 -25 ...
Page 3
P1dB vs. Temperature FREQUENCY (GHz) Output IP3 vs. Temperature FREQUENCY (GHz) Power Compression @ 10 GHz 24 ...
Page 4
Absolute Maximum Ratings Drain Bias Voltage (Vdd) +10 Vdc Gate Bias Voltage (Vgg) -2 Vdc RF Input Power (RFIN)(Vdd = +10 Vdc) +23 dBm Channel Temperature 175 °C Continuous Pdiss (T= 85 °C) 2.3 W (derate 26 ...
Page 5
Outline Drawing 2 Die Packaging Information Standard GP-2 [1] Refer to the “Packaging Information” section for die packaging dimensions. [2] For alternate packaging information contact Hittite Microwave Corporation. For price, delivery, and to place orders, please contact Hittite Microwave Corporation: ...
Page 6
Pad Descriptions Pad Number Function Vdd External bypass capacitors are required. 3 OUT 4 Vgg Please follow “MMIC Amplifi er Biasing Procedure” Die Bottom GND Die bottom must be connected to RF/DC ground. For price, delivery, ...
Page 7
Assembly Diagram 2 Application Circuit For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 v04.1108 GaAs PHEMT MMIC WIDEBAND DRIVER AMPLIFIER ...
Page 8
Mounting & Bonding Techniques for Millimeterwave GaAs MMICs The die should be attached directly to the ground plane eutectically or with conductive epoxy (see HMC general Handling, Mounting, Bonding Note). 50 Ohm Microstrip transmission lines on 0.127mm (5 mil) ...