HMC560_09 HITTITE [Hittite Microwave Corporation], HMC560_09 Datasheet

HMC560_09

Manufacturer Part Number

HMC560_09

Description

GaAs MMIC FUNDAMENTAL MIXER, 24 - 40 GHz

Manufacturer

HITTITE [Hittite Microwave Corporation]

Datasheet

1.HMC560_09.pdf (6 pages)

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Typical Applications

The HMC560 is ideal for:

• Test Equipment & Sensors

• Microwave Point-to-Point Radios

• Point-to-Multi-Point Radios

• Military & Space

Functional Diagram

Electrical Specifi cations,

Frequency Range, RF & LO

Frequency Range, IF

Conversion Loss

Noise Figure (SSB)

LO to RF Isolation

LO to IF Isolation

RF to IF Isolation

IP3 (Input)

IP2 (Input)

1 dB Compression (Input)

* Unless otherwise noted, all measurements performed as downconverter

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Parameter

v01.0408

= +25° C, IF = 1GHz, LO = +13 dBm*

Order On-line at www.hittite.com

Min.

DC - 18

24 - 36

Typ.

Features

Wide IF Bandwidth: DC - 18 GHz

Input IP3: +21 dBm

High LO/RF Isolation: 35 dB

Passive Double Balanced Topology

Compact Size: 1.15 x 0.78 x 0.1 mm

General Description

The HMC560 chip is a miniature passive double bal-

anced mixer which is fabricated in a GaAs MESFET

process, and can be used as an upconverter or down-

converter from 24-40 GHz in a small chip area. The

wide bandwidth allows this device to be used across

multiple radio bands with a common platform. Excel-

lent isolations are provided by on-chip baluns, and

the chip requires no external components and no

DC bias. Measurements were made with the chip

mounted and ribbon bonded into in a 50-ohm micro-

strip test fi xture. Measured data includes the parasitic

effects of the assembly. RF connections to the chip

were made with 0.076mm (3-mil) ribbon bond with

minimal length <0.31mm (<12 mil).

Max.

GaAs MMIC FUNDAMENTAL

Min.

MIXER, 24 - 40 GHz

DC - 18

36 - 40

Typ.

HMC560

Max.

Units

GHz

dBm

Related parts for HMC560_09

HMC560_09 Summary of contents

Page 1

Typical Applications The HMC560 is ideal for: • Test Equipment & Sensors • Microwave Point-to-Point Radios • Point-to-Multi-Point Radios • Military & Space 4 Functional Diagram Electrical Specifi cations, Parameter Frequency Range, RF & LO Frequency Range, IF Conversion Loss ...

Page 2

Conversion Gain vs. Temperature @ LO = +13 dBm 0 -5 -10 +25 C -15 +85 C - FREQUENCY (GHz) Conversion Gain vs. LO Drive 0 -5 ...

Page 3

Input IP3 vs. LO Drive * FREQUENCY (GHz) Input IP2 vs. LO Drive * ...

Page 4

Absolute Maximum Ratings Input +25 dBm LO Drive +23 dBm IF DC Current ±2 mA Channel Temperature 150 °C/W Continuous Pdiss (T= 85 °C ) 0.961 W (derate 14.79 mW/ °C above 85 °C) Thermal Resistance ...

Page 5

Pad Descriptions Pad Number Function GND Assembly Drawing For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 ...

Page 6

Mounting & Bonding Techniques for Millimeterwave GaAs MMICs The die should be attached directly to the ground plane eutectically or with conductive epoxy (see HMC general Handling, Mounting, Bonding Note). 50 Ohm Microstrip transmission lines on 0.127mm (5 mil) ...

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