HMC560LM3_08 HITTITE [Hittite Microwave Corporation], HMC560LM3_08 Datasheet

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HMC560LM3_08

Manufacturer Part Number
HMC560LM3_08
Description
GaAs MMIC FUNDAMENTAL SMT MIXER, 24 - 40 GHz
Manufacturer
HITTITE [Hittite Microwave Corporation]
Datasheet
9 - 348
9
Typical Applications
The HMC560LM3 is ideal for:
• Test Equipment & Sensors
• Point-to-Point Radios
• Point-to-Multi-Point Radios
• Military & Space
Functional Diagram
Electrical Specifi cations,
Frequency Range, RF & LO
Frequency Range, IF
Conversion Loss
Noise Figure (SSB)
LO to RF Isolation
LO to IF Isolation
RF to IF Isolation
IP3 (Input)
IP2 (Input)
1 dB Compression (Input)
* Unless otherwise noted, all measurements performed as downconverter
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
Parameter
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
T
A
v01.0507
= +25° C, IF = 1 GHz, LO = +13 dBm*
Order On-line at www.hittite.com
Min.
25
23
16
DC - 17
24 - 36
Typ.
10
10
35
30
20
18
50
13
Features
Wide IF Bandwidth: DC - 17 GHz
Input IP3: +21 dBm
High LO/RF Isolation: 35 dB
Passive Double Balanced Topology
Leadless RoHS Compliant SMT Package, 25 mm
General Description
The HMC560LM3 is a 24 - 40 GHz passive, double-
balanced MMIC mixer in a SMT leadless chip carrier
package. The mixer is fabricated in a GaAs MESFET
process, and can be used as a downconverter or
upconverter. The wide operating bandwidth allows this
device to be used across multiple radio bands with a
common platform. Excellent isolations are provided by
on-chip baluns. The HMC560LM3 requires no external
components and no DC bias. All data is with the
non-hermetic, epoxy sealed LM3 package mounted
in a 50 Ohm test fi xture. Utilizing the HMC560LM3
eliminates the need for wirebonding, thereby providing
a consistent connection interface for the customer,
and allowing the use of surface mount manufacturing
techniques.
Max.
12
12
GaAs MMIC FUNDAMENTAL
SMT MIXER, 24 - 40 GHz
Min.
22
18
20
HMC560LM3
DC - 17
36 - 40
Typ.
28
25
25
21
40
15
11
11
Max.
14
14
Units
GHz
GHz
dBm
dBm
dBm
dB
dB
dB
dB
dB
2

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HMC560LM3_08 Summary of contents

Page 1

Typical Applications The HMC560LM3 is ideal for: • Test Equipment & Sensors • Point-to-Point Radios • Point-to-Multi-Point Radios 9 • Military & Space Functional Diagram Electrical Specifi cations, Parameter Frequency Range, RF & LO Frequency Range, IF Conversion Loss Noise ...

Page 2

Conversion Gain vs. Temperature @ LO = +13 dBm 0 -5 -10 +25 C -15 +85 C - FREQUENCY (GHz) Conversion Gain vs. LO Drive 0 +7 dBm ...

Page 3

Input IP3 vs. LO Drive FREQUENCY (GHz) Input IP2 vs. LO Drive FREQUENCY (GHz) ...

Page 4

Absolute Maximum Ratings Input +25 dBm LO Drive +23 dBm IF DC Current ±2 mA Channel Temperature 150 °C/W Continuous Pdiss (T= 85 °C ) 0.344 W (derate 5.3 mW/ °C above 85 °C) Thermal Resistance ...

Page 5

Pin Descriptions Pin Number Function N GND For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 9 ...

Page 6

Evaluation PCB The grounded Co-Planar Wave Guide (CPWG) PCB input/output transitions allow use of Ground-Signal-Ground (GSG) probes for testing. Suggested probe pitch is 400 mm (16 mils). Alternatively, the board can be mounted in a metal housing with 2.4 ...

Page 7

Suggested LM3 PCB Land Pattern 9 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 9 - 354 v01.0507 GaAs MMIC FUNDAMENTAL SMT MIXER ...

Page 8

Recommended SMT Attachment Technique Preparation & Handling of the LM3 Millimeterwave Package for Surface Mounting The HMC LM3 package was designed to be compatible with high volume surface mount PCB assembly processes. The LM3 package requires a specifi c ...

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