HMC530LP5E HITTITE [Hittite Microwave Corporation], HMC530LP5E Datasheet - Page 4

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HMC530LP5E

Manufacturer Part Number
HMC530LP5E
Description
MMIC VCO w/ HALF FREQUENCY OUTPUT & DIVIDE-BY-4, 9.5 - 10.8 GHz
Manufacturer
HITTITE [Hittite Microwave Corporation]
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HMC530LP5E
Manufacturer:
HITTITE
Quantity:
20 000
Part Number:
HMC530LP5ETR
Manufacturer:
HITTITE
Quantity:
12 800
Outline Drawing
Package Information
Pin Descriptions
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
1 - 3, 8 - 10, 13 - 18,
20, 22 - 28, 30 - 32
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
HMC530LP5E
HMC530LP5
Part Number
Pin Number
4
6
Phone: 978-250-3343
RoHS-compliant Low Stress Injection Molded Plastic
RFOUT/4
Vcc (Dig)
Function
N/C
Application Support: Phone: 978-250-3343 or apps@hittite.com
Low Stress Injection Molded Plastic
Package Body Material
No Connection. These pins may be connected to RF/
Supply voltage for prescaler. If prescaler is not
required, this pin may be left open to conserve
DC ground. Performance will not be affected.
v07.0411
Divide-by-4 output. DC block required.
approximately 65 mA of current.
Fax: 978-250-3373
MMIC VCO w/ HALF FREQUENCY OUTPUT
Description
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
4. PAD BURR LENGTH SHALL BE 0.15 mm MAXIMUM.
5. PACKAGE WARP SHALL NOT EXCEED 0.05 mm.
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE
7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED LAND PATTERN.
PAD BURR HEIGHT SHALL BE 0.05 mm MAXIMUM.
SOLDERED TO PCB RF GROUND.
100% matte Sn
Sn/Pb Solder
Order On-line at www.hittite.com
Lead Finish
HMC530LP5 / 530LP5E
& DIVIDE-BY-4, 9.5 - 10.8 GHz
MSL Rating
MSL3
MSL3
[1]
[2]
Interface Schematic
Package Marking
XXXX
XXXX
H530
H530
[3]
8 - 4
8

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