TQM756014 TRIQUINT [TriQuint Semiconductor], TQM756014 Datasheet

TQM756014

Manufacturer Part Number

TQM756014

Description

Multi-Mode (WCDMA B4, CDMA BC15, HSPA+, LTE) 3x3 PA Module

Manufacturer

TRIQUINT [TriQuint Semiconductor]

Datasheet

1.TQM756014.pdf (1 pages)

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Functional Block Diagram

Product Description

The TQM756014 is fully matched Power Amplifier Module designed for use in

CDMA BC15 (AWS), WCDMA (Bands 4) and LTE handsets. Its compact 3x3mm

package including a coupler and built-in voltage regulator makes it ideal for

today’s extremely small data enabled phones. Its RF performance meets the

stringent linearity requirements for multi-mode operation.

The TQM756014 is designed on TriQuint’s GaAs BiHEMT technology with CuFlip

assembly offering state of the art reliability, temperature stability and ruggedness.

The 3-Gain state PA die operates in LPM, MPM and HPM to maximize talk time

over the entire range of operating conditions. To simplify the cost/time of

calibration while in production the TQM776011 can be used in 1-bit operation;

either LPM/HPM with only 4mA of IcQ up to +13dBm in LPM, or MPM/HPM with

9mA of IcQ up to +17dBm in MPM.

Electrical Specifications

Parameter

Frequency

WCDMA mode maximum Pout

LPM Quiescent Current

ACLR5

ACLR10

Power Supply Current @ 28.3dBm

Rx Band Noise

Note 1: Test Conditions WCDMA Rel99 Test Mode: V

Data Sheet:

For additional information and latest specifications, see our website:

Revision J, August 08, 2012

Vmode1

Vmode0

Multi-Mode (WCDMA B4, CDMA BC15, HSPA+, LTE) 3x3 PA Module

VCC1

RF IN

VEN

2 - Bit Bias Control

=3.4VDC, V

1733

28.3

-142

Typ

490

-40

-54

=HIGH, Tc=25°C

www.triquint.com

dBm/Hz

VCC2

RF OUT

CPLR IN

GND

CPLR OUT

Units

MHz

dBm

dBc

Features

 GaAs BiHEMT / CuFlip

 Typical Quiescent Current values:

 Excellent Linearity in all modes

 Integrated high performance coupler

 Excellent Phase Discontinuity

 Built-in voltage regulator functionality

 Small 10-pin, 3x3mm module

 Lead-free 260°C / RoHS / Halogen-free

 Full ESD protection

Applications

 WCDMA B4 Handsets

 CDMA2000 BC15 (AWS) Applications

 HSUPA, HSDPA, HSPA+ Applications

 LTE-Compatible Applications

Package Style

LPM: 4 mA

MPM: 9 mA

HPM: 90 mA

eliminating any external switch circuitry

Top View (through package)

10-Pin Laminate Module

TQM756014

PA Technology

Data Sheet

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