SE1000W SIGE [SiGe Semiconductor, Inc.], SE1000W Datasheet - Page 8

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SE1000W

Manufacturer Part Number
SE1000W
Description
LightChargerTM155 Mb/s Transimpedance Amplifier Final
Manufacturer
SIGE [SiGe Semiconductor, Inc.]
Datasheet
Applications Information
For optimum performance it is recommended that the device be used in differential mode with the circuit shown in the
first diagram below.
Note that the two VCC1 pads (2, 10) are connected on-chip, as are the VEE1 pads (6, 7), and only one pad of each
type is required to be bonded out. However, in order to minimize inductance for optimum high speed performance, it
is recommended that all power pads are wire bonded. The VEE2 and VCC2 pads are not connected on chip to VEE1
and VCC1 respectively, and must be bonded out separately.
Connections for differential operation:
Connections for single-ended operation:
40-DST-01 § Rev 1.5 § May 24/02
+5 V
+5 V
–ve bias
–ve bias
0 V or
0 V or
PIN
PIN
3
3
0 V
0 V
TZ_IN
TZ_IN
VEE2
VEE2
VCC2
VCC2
1
1
4
4
TZ Amplifier
TZ Amplifier
SE1000W
SE1000W
LightCharger
VEE1
VEE1
VCC1
VCC1
2 10
2
6
6
10
7
7
ACGND
ACGND
TM
OUTN
OUTN
OUTP
OUTP
155 Mb/s Transimpedance Amplifier
5
5
NC
1 nF
9
9
8
8
1 nF min
1 nF min
To 50 O loads,
AC coupled
To 50 O load,
AC coupled
NC
SE1000W
Final
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