HCTS365HMSR INTERSIL [Intersil Corporation], HCTS365HMSR Datasheet - Page 10

• Manufacturer Part Number: HCTS365HMSR
• Description: Radiation Hardened Hex Buffer/Line Driver Non-Inverting
• Manufacturer: INTERSIL [Intersil Corporation]

Die Characteristics
DIE DIMENSIONS:
METALLIZATION:
GLASSIVATION:
WORST CASE CURRENT DENSITY:
BOND PAD SIZE:
Metallization Mask Layout
NOTE: The die diagram is a generic plot form a similar HCS device. It is intended to indicate approximate die size and bond pad location.
108 x 106 mils
Type: AlSi
Metal Thickness: 11k
Type: SiO
Thickness: 13k
<2.0 x 10
100 m x 100 m
4 mils x 4 mils
The mask series for the HCTS365 is TA14413A.
A3 (6)
A2 (4)
Y2 (5)
NC
5
2
A/cm
Å
2
2.6k
Å
Y1
(3)
Å
1k
Å
NC
(7)
Y3
A1
(2)
HCTS365MS
GND
(8)
HCTS365MS
OE1
(1)
10
NC
VCC
(16)
(9)
Y4
OE2
(15)
(10)
A4
Spec Number
NC
(14) A6
(13) Y6
(12) A5
(11) Y5
518637