HCTS109HMSR INTERSIL [Intersil Corporation], HCTS109HMSR Datasheet - Page 9

• Manufacturer Part Number: HCTS109HMSR
• Description: Radiation Hardened Dual JK Flip Flop
• Manufacturer: INTERSIL [Intersil Corporation]

Die Characteristics
DIE DIMENSIONS:
METALLIZATION:
GLASSIVATION:
WORST CASE CURRENT DENSITY:
BOND PAD SIZE:
Metallization Mask Layout
NOTE: The die diagram is a generic plot form a similar HCS device. It is intended to indicate approximate die size and bond pad location.
89 x 88 mils
2.25 X 2.24mm
Type: AlSi
Metal Thickness: 11k
Type: SiO
Thickness: 13k
<2.0 x 10
100 m x 100 m
4 mils x 4 mils
The mask series for the HCTS109 is TA14440A.
CP1 (4)
Q1 (6)
Q1 (7)
K1 (3)
S1 (5)
5
2
A/cm
Å
2
2.6k
Å
Å
1k
Å
GND
(2)
(8)
J1
HCTS109MS
HCTS109MS
R1
(1)
Q2
(9)
18
(10)
VCC
Q2
(16)
Spec Number
(15) R2
(14) J2
(13) K2
(12) CP2
(11) S2
518601