HCTS109HMSR INTERSIL [Intersil Corporation], HCTS109HMSR Datasheet

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HCTS109HMSR

Manufacturer Part Number
HCTS109HMSR
Description
Radiation Hardened Dual JK Flip Flop
Manufacturer
INTERSIL [Intersil Corporation]
Datasheet
September 1995
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999
Features
• 3 Micron Radiation Hardened SOS CMOS
• Total Dose 200K RAD (Si)
• SEP Effective LET No Upsets: >100 MEV-cm
• Single Event Upset (SEU) Immunity < 2 x 10
• Dose Rate Survivability: >1 x 10
• Dose Rate Upset >10
• Latch-Up Free Under Any Conditions
• Military Temperature Range: -55
• Significant Power Reduction Compared to LSTTL ICs
• DC Operating Voltage Range: 4.5V to 5.5V
• LSTTL Input Logic Compatibility
• Input Current Levels Ii
Description
The Intersil HCTS109MS is a Radiation Hardened Dual JK
Flip Flop with set and reset. The flip flop changes state with
the positive transition of the clock (CP1 or CP2).
The HCTS109MS utilizes advanced CMOS/SOS technology
to achieve high-speed operation. This device is a member of
radiation hardened, high-speed, CMOS/SOS Logic Family.
The HCTS109MS is supplied in a 16 lead Ceramic flatpack
(K suffix) or a SBDIP Package (D suffix).
Ordering Information
HCTS109DMSR
HCTS109KMSR
HCTS109D/Sample
HCTS109K/Sample
HCTS109HMSR
Bit-Day (Typ)
- VIL = 0.8V Max
- VIH = VCC/2 Min
PART NUMBER
10
RAD (Si)/s 20ns Pulse
5 A at VOL, VOH
TEMPERATURE RANGE
12
o
C to +125
RAD (Si)/s
-55
-55
o
o
C to +125
C to +125
+25
+25
+25
o
o
o
o
C
C
C
C
2
/mg
-9
o
o
C
C
Errors/
10
Pinouts
Intersil Class S Equivalent
Intersil Class S Equivalent
Sample
Sample
Die
HCTS109MS
GND
CP1
SCREENING LEVEL
Q1
Q1
R1
K1
S1
J1
MIL-STD-1835 CDFP4-F16, LEAD FINISH C
MIL-STD-1835 CDIP2-T16, LEAD FINISH C
FLATPACK PACKAGE (FLATPACK)
16 LEAD CERAMIC DUAL-IN-LINE
16 LEAD CERAMIC METAL SEAL
METAL SEAL PACKAGE (SBDIP)
GND
CP1
Q1
Q1
K1
S1
J1
RI
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
TOP VIEW
TOP VIEW
Radiation Hardened
16 Lead SBDIP
16 Lead Ceramic Flatpack
16 Lead SBDIP
16 Lead Ceramic Flatpack
Die
Dual JK Flip Flop
16
15
14
13
12
11
10
9
16
15
14
13
12
11
10
Spec Number
9
File Number
PACKAGE
VCC
R2
J2
K2
CP2
S2
Q2
Q2
VCC
R2
J2
K2
CP2
S2
Q2
Q2
518601
2141.2

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HCTS109HMSR Summary of contents

Page 1

... SBDIP Package (D suffix). Ordering Information PART NUMBER TEMPERATURE RANGE HCTS109DMSR HCTS109KMSR HCTS109D/Sample HCTS109K/Sample HCTS109HMSR CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999 HCTS109MS Pinouts MIL-STD-1835 CDIP2-T16, LEAD FINISH C 2 /mg ...

Page 2

Functional Diagram 5 (11 (14 (13 (12 (15) R VCC GND *Unpredictable and unstable ...

Page 3

Absolute Maximum Ratings Supply Voltage (VCC -0.5V to +7.0V Input Voltage Range, All Inputs . . ...

Page 4

TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS (NOTES 1, 2) PARAMETER SYMBOL CONDITIONS TPLH VCC = 4.5V VCC = 4.5V TPHL VCC = 4.5V VCC = 4. TPLH VCC = 4.5V VCC = 4.5V ...

Page 5

TABLE 4. DC POST RADIATION ELECTRICAL PERFORMANCE CHARACTERISTICS PARAMETER SYMBOL Quiescent Current ICC Output Current (Sink) IOL Output Current IOH (Source) Output Voltage Low VOL Output Voltage High VOH Input Leakage Current IIN Noise Immunity FN Functional Test CP to ...

Page 6

CONFORMANCE GROUPS Initial Test (Preburn-In) Interim Test I (Postburn-In) Interim Test II (Postburn-In) PDA Interim Test III (Postburn-In) PDA Final Test Group A (Note 1) Group B Subgroup B-5 Subgroup B-6 Group D NOTES: 1. Alternate Group A testing in ...

Page 7

Intersil Space Level Product Flow - ‘MS’ Wafer Lot Acceptance (All Lots) Method 5007 (Includes SEM) GAMMA Radiation Verification (Each Wafer) Method 1019, 4 Samples/Wafer, 0 Rejects 100% Nondestructive Bond Pull, Method 2023 Sample - Wire Bond Pull Monitor, Method ...

Page 8

AC Timing Diagrams VIH INPUT VS VIL TPLH VOH VS OUTPUT VOL TTLH VOH 80% 20% OUTPUT VOL Pulse Width, Setup, Hold Timing Diagram Positive Edge Trigger INPUT TW VIH VS VIL TH TSU TW INPUT CP VIH VS VIL ...

Page 9

Die Characteristics DIE DIMENSIONS mils 2.25 X 2.24mm METALLIZATION: Type: AlSi Å Å Metal Thickness: 11k 1k GLASSIVATION: Type: SiO 2 Å Å Thickness: 13k 2.6k WORST CASE CURRENT DENSITY <2 A/cm BOND ...

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