MF1PLUS6001DA403 NXP [NXP Semiconductors], MF1PLUS6001DA403 Datasheet - Page 3

• Manufacturer Part Number: MF1PLUS6001DA403
• Description: Mainstream contactless smart card IC for fast and easy solution development
• Manufacturer: NXP [NXP Semiconductors]

NXP Semiconductors
5. Ordering information
Table 2.
MF1PLUSX0Y1_SDS
Product short data sheet
PUBLIC
Type number
MF1PLUS8001DUD/03
MF1PLUS8011DUD/03
MF1PLUS8031DUD/03
MF1PLUS8001DA4/03
MF1PLUS8011DA4/03
MF1PLUS8031DA4/03
MF1PLUS6001DUD/03
MF1PLUS6011DUD/03
MF1PLUS6031DUD/03
MF1PLUS6001DA4/03
MF1PLUS6011DA4/03
MF1PLUS6031DA4/03
MF1PLUS8001DUD/13
Ordering information
Package
Commercial
name
FFC
FFC
FFC
MOA4
MOA4
MOA4
FFC
FFC
FFC
MOA4
MOA4
MOA4
FFC
All information provided in this document is subject to legal disclaimers.
Name
-
-
-
PLLMC
PLLMC
PLLMC
-
-
-
PLLMC
PLLMC
PLLMC
-
Rev. 3.2 — 21 February 2011
163532
Description
8 inch wafer (sawn; 120 µm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see
4 kB EEPROM, 7-byte UID, L1 card
8 inch wafer (sawn; 120 µm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see
4 kB EEPROM, 4-byte UID, L1 card
8 inch wafer (sawn; 120 µm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see
4 kB EEPROM, 4-byte NUID, L1 card
plastic leadless module carrier package; 35 mm
wide tape, 4 kB EEPROM, 7-byte UID, L1 card
plastic leadless module carrier package; 35 mm
wide tape, 4 kB EEPROM, 4-byte UID, L1 card
plastic leadless module carrier package; 35 mm
wide tape, 4 kB EEPROM, 4-byte NUID, L1 card
8 inch wafer (sawn; 120 µm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see
2 kB EEPROM, 7-byte UID, L1 card
8 inch wafer (sawn; 120 µm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see
2 kB EEPROM, 4-byte UID, L1 card
8 inch wafer (sawn; 120 µm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see
2 kB EEPROM, 4-byte NUID, L1 card
plastic leadless module carrier package; 35 mm
wide tape, 2 kB EEPROM, 7-byte UID, L1 card
plastic leadless module carrier package; 35 mm
wide tape, 2 kB EEPROM, 4-byte UID, L1 card
plastic leadless module carrier package; 35 mm
wide tape, 2 kB EEPROM, 4-byte NUID, L1 card
8 inch wafer (sawn; 120 µm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see
4 kB EEPROM, 7-byte UID, no security level 1 or
2, L3 card
Mainstream contactless smart card IC
MF1PLUSx0y1
Ref.
Ref.
Ref.
Ref.
Ref.
Ref.
Ref.
3,
3,
3,
3,
3,
3,
3,
© NXP B.V. 2011. All rights reserved.
Version
-
-
-
SOT500-2
SOT500-2
SOT500-2
-
-
-
SOT500-2
SOT500-2
SOT500-2
-
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