ISL6615 INTERSIL [Intersil Corporation], ISL6615 Datasheet - Page 7

• Manufacturer Part Number: ISL6615
• Description: High-Frequency 6A Sink Synchronous MOSFET Drivers with Protection Features
• Manufacturer: INTERSIL [Intersil Corporation]

Schottky diode that is used in some systems for protecting
the load from reversed output voltage events.
In addition, more than 400mV hysteresis also incorporates
into the Tri-state shutdown window to eliminate PWM input
oscillations due to the capacitive load seen by the PWM
input through the body diode of the controller’s PWM output
when the power-up and/or power-down sequence of bias
supplies of the driver and PWM controller are required.
Power-On Reset (POR) Function
During initial start-up, the VCC voltage rise is monitored.
Once the rising VCC voltage exceeds 6.4V (typically),
operation of the driver is enabled and the PWM input signal
takes control of the gate drives. If VCC drops below the
falling threshold of 5.0V (typically), operation of the driver is
disabled.
Pre-POR Overvoltage Protection
Prior to VCC exceeding its POR level, the upper gate is held
low and the lower gate is controlled by the overvoltage
protection circuits. The upper gate driver is powered from
PVCC and will be held low when a voltage of 2.75V or higher
is present on PVCC as VCC surpasses its POR threshold.
The PHASE is connected to the gate of the low side
MOSFET (LGATE), which provides some protection to the
microprocessor if the upper MOSFET(s) is shorted during
start-up, normal, or shutdown conditions. For complete
protection, the low side MOSFET should have a gate
threshold well below the maximum voltage rating of the
load/microprocessor.
Internal Bootstrap Device
Both drivers feature an internal bootstrap Schottky diode.
Simply adding an external capacitor across the BOOT and
PHASE pins completes the bootstrap circuit. The bootstrap
function is also designed to prevent the bootstrap capacitor
from overcharging due to the large negative swing at the
trailing-edge of the PHASE node. This reduces voltage
stress on the boot to phase pins.
The bootstrap capacitor must have a maximum voltage
rating above PVCC + 5V and its capacitance value can be
chosen from Equation 1:
where Q
V
MOSFETs. The ΔV
droop in the rail of the upper gate drive.
As an example, suppose two IRLR7821 FETs are chosen as
the upper MOSFETs. The gate charge, Q
sheet is 10nC at 4.5V (V
C
Q
GS1
BOOT_CAP
GATE
gate-source voltage and N
=
G1
Q
----------------------------------- - N
is the amount of gate charge per upper MOSFET at
G1
≥
V
------------------------------------- -
ΔV
•
GS1
PVCC
BOOT_CAP
Q
BOOT_CAP
GATE
•
GS
Q1
) gate-source voltage. Then the
term is defined as the allowable
7
Q1
is the number of control
G
, from the data
(EQ. 1)
ISL6615
Q
assume a 200mV droop in drive voltage over the PWM
cycle. We find that a bootstrap capacitance of at least
0.267µF is required. The next larger standard value
capacitance is 0.33µF. A good quality ceramic capacitor is
recommended.
Gate Drive Voltage Versatility
The ISL6615 provides the user with flexibility in choosing the
gate drive voltage for efficiency optimization. The ISL6615
ties the upper and lower drive rails together. Simply applying
a voltage from +4.5V up to 13.2V on PVCC sets both gate
drive rail voltages simultaneously, while VCC’s operating
range is from +6.8V up to 13.2V.
Power Dissipation
Package power dissipation is mainly a function of the
switching frequency (F
external gate resistance, and the selected MOSFET’s
internal gate resistance and total gate charge. Calculating
the power dissipation in the driver for a desired application is
critical to ensure safe operation. Exceeding the maximum
allowable power dissipation level will push the IC beyond the
maximum recommended operating junction temperature of
+125°C. The maximum allowable IC power dissipation for
the SO8 package is approximately 800mW at room
temperature, while the power dissipation capacity in the DFN
package, with an exposed heat escape pad, is more than
1.5W. The DFN package is more suitable for high frequency
applications. See “Layout Considerations” on page 8 for
thermal transfer improvement suggestions. When designing
the driver into an application, it is recommended that the
following calculation is used to ensure safe operation at the
desired frequency for the selected MOSFETs. The total gate
drive power losses due to the gate charge of MOSFETs and
the driver’s internal circuitry and their corresponding average
driver current can be estimated with Equations 2 and 3,
respectively.
GATE
FIGURE 2. BOOTSTRAP CAPACITANCE vs BOOT RIPPLE
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
is calculated to be 53nC for PVCC = 12V. We will
0.0
20nC
0.1
VOLTAGE
0.2
50nC
Q
GATE
SW
0.3
), the output drive impedance, the
= 100nC
ΔV
0.4
BOOT_CAP
0.5
0.6
(V)
0.7
0.8
April 24, 2008
0.9
FN6481.0
1.0