SSD1801AV ETC [List of Unclassifed Manufacturers], SSD1801AV Datasheet - Page 5

• Manufacturer Part Number: SSD1801AV
• Description: LCD Segment / Common Driver with Controller for Character Display System
• Manufacturer: ETC [List of Unclassifed Manufacturers]

PIN ARRANGEMENT OF SSD1801Z GOLD BUMP DIE
Alignment Keys
Die Size:
Die Thickness:
PAD: 1-63
PAD: 65-79,
PAD: 81-162
PAD: 64,80,163,179
Bump Height: Nominal
Note:
1. The die faces up in the diagram.
2. Coordinates are reference to the center of the chip.
3. Unit of coordinates and size of all alignment keys are in um.
4. All alignment keys do not contain gold bump.
SOLOMON
26.3 µm 26.3 µm 26.3 µm
Center (-2940.9, 480.0)
X
(-2835, -598.5)
8.75µm
X
37.6µm
6170um x 1480um (include scribe line)
6070um x 1380um (exclude scribe line)
670 +/-25um
Bump Size
52.15 X 52.15 um
18um
52.15 x 60.2 um
164-178 74.9 x 42 um
42 x 74.9 um
Figure 2 – SSD1801Z Pin Arrangement
26.3 µm 26.3 µm 26.3 µm
Center (2940.9, 480.0)
X
Minimum Pitch
76.3um
63.7um
63.7um
(2835, -598.5)
8.75µm
X
37.6µm
Rev 1
01/2003
.
1
Center (-2101.9, 169.6)
61.3µm
SSD1801 Series
X
4