MAAPGM0068-DIE MACOM [Tyco Electronics], MAAPGM0068-DIE Datasheet - Page 8

• Manufacturer Part Number: MAAPGM0068-DIE
• Description: Amplifier, Power, 1.2W 5.7-8.5 GHz
• Manufacturer: MACOM [Tyco Electronics]

Amplifier, Power, 1.2W
5.7-8.5 GHz
Assembly and Bonding Diagram
Assembly Instructions:
Die Attach: Use AuSn (80/20) 1 mil. preform solder. Limit time @ 310 °C to less than
7 minutes. Refer to Application Note AN3017 for more detailed information.
Wirebonding: Bond @ 160 °C using standard ball or thermal compression wedge
bond techniques. For DC pad connections, use either ball or wedge bonds. For best
RF performance, use wedge bonds of shortest length, although ball bonds are also
acceptable.
Biasing Note: Must apply negative bias to V
damage to amplifier.
Die Handling:
Refer to Application Note AN3016.
Figure 24. Recommended operational configuration. Wire bond as shown.
0.01-0.1μF
V
GG
RF
VDD
VGG
Gnd
RF
IN
GND
300 Ω
200 pF
100-
GG
before applying positive bias to V
200 pF
100-
V
DD
GND
V
DD
0.01-0.1μF
DD
MAAPGM0068-DIE
RF
to prevent
OUT
Preliminary Datasheet
Rev B