MAAPGM0068-DIE MACOM [Tyco Electronics], MAAPGM0068-DIE Datasheet - Page 7
MAAPGM0068-DIE
Manufacturer Part Number
MAAPGM0068-DIE
Description
Amplifier, Power, 1.2W 5.7-8.5 GHz
Manufacturer
MACOM [Tyco Electronics]
Datasheet
1.MAAPGM0068-DIE.pdf
(8 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MAAPGM0068-DIE
Manufacturer:
m/a-com
Quantity:
5 000
Amplifier, Power, 1.2W
5.7-8.5 GHz
Mechanical Information
Chip Size: 2.000 x 3.150 x 0.075 mm
Bond Pad Dimensions
DC Drain Supply Voltage VDD
DC Gate Supply Voltage VGG
RF In and Out
Chip edge to bond pad dimensions are shown to the center of the bond pad.
Pad
Figure 23. Die Layout
(
78 x 124 x 3 mils)
Size (μm)
100 x 200
200 x 150
150 x 150
Size (mils)
MAAPGM0068-DIE
4 x 8
8 x 6
6 x 6
Preliminary Datasheet
Rev B