MAAPGM0046-DIE MACOM [Tyco Electronics], MAAPGM0046-DIE Datasheet - Page 6
![no-image](/images/no-image-200.jpg)
MAAPGM0046-DIE
Manufacturer Part Number
MAAPGM0046-DIE
Description
400mW Ku-Band Power Amplifier (15.5-18.0 GHz)
Manufacturer
MACOM [Tyco Electronics]
Datasheet
1.MAAPGM0046-DIE.pdf
(6 pages)
Specifications subject to change without notice.
Email: macom_adbu_ics@tycoelectronics.com
Visit www.macom.com for additional data sheets and product information.
400mW Ku-Band Power Amplifier
North America: Tel. (800) 366-2266
Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298
Assembly Instructions:
Die attach: Use AuSn (80/20) 1-2 mil. preform solder. Limit time @ 300 °C to less than 5 minutes.
Wirebonding: Bond @ 160 °C using standard ball or thermal compression wedge bond techniques. For
DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of
shortest length, although ball bonds are also acceptable.
Biasing Note: Must apply negative bias to V
damage to amplifier.
Figure 6. Recommended bonding diagram for pedestal mount.
Support circuitry typical of MMIC characterization fixture for CW testing.
RF
IN
V
IN
GG
GND:G
GND:G
GND:G
150 Ω
GND:G
GND:G
GND:G
0.1 µF
GG
100 pF
100 pF
V
V
before applying positive bias to V
GG
DD
GND:G
GND:G
0.1 µF
GND:G
GND:G
GND:G
GND:G
GND:G
GND:G
OUT
V
DD
MAAPGM0046-DIE
RF
OUT
DD
to prevent