MAAPGM0046-DIE MACOM [Tyco Electronics], MAAPGM0046-DIE Datasheet - Page 5

• Manufacturer Part Number: MAAPGM0046-DIE
• Description: 400mW Ku-Band Power Amplifier (15.5-18.0 GHz)
• Manufacturer: MACOM [Tyco Electronics]

Specifications subject to change without notice.
Email: [e-mail]
Visit www.macom.com for additional data sheets and product information.
400mW Ku-Band Power Amplifier
North America: Tel. [phone]
Europe: Tel. [phone], Fax[phone]
Asia/Pacific: Tel.[phone], Fax [phone]
Bond Pad Dimensions
1.66mm.
0.86mm.
0.16mm.
Mechanical Information
Chip Size: 3.000 x 1.824 x 0.075 mm
0
RF: IN, OUT
DC: V
DC: V
Pad
0
GG
DD
IN
Chip edge to bond pad dimensions are shown to the center of the bond pad.
GND:G
GND:G
GND:G
GND:G
GND:G
GND:G
Figure 5. Die Layout
V
V
DD
GG
Size ( µ m)
100 x 200
200 x 150
150 x 150
GND:G
GND: G
(
118 x 72 x 3 mils)
GND:G
GND:G
GND:G
GND:G
GND:G
GND:G
MAAPGM0046-DIE
OUT
Size (mils)
4 x 8
8 x 6
6 x 6
0.86mm.
1.82mm.