MAAPGM0034-DIE MACOM [Tyco Electronics], MAAPGM0034-DIE Datasheet - Page 6

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MAAPGM0034-DIE

Manufacturer Part Number
MAAPGM0034-DIE
Description
0.5W X/Ku-Band Power Amplifier 8.0-12.5 GHz
Manufacturer
MACOM [Tyco Electronics]
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MAAPGM0034-DIE
Manufacturer:
M/A-COM
Quantity:
20 000
Specifications subject to change without notice.
Email: macom_adbu_ics@tycoelectronics.com
0.5W X/Ku-Band Power Amplifier
North America: Tel. (800) 366-2266
Europe: Tel. +44 (1908) 574 200, Fax+44 (1908) 574 300
Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298
Assembly Instructions:
Die attach: Use AuSn (80/20) 1-2 mil. preform solder. Limit time @ 300 °C to less than 5 minutes.
Wirebonding: Bond @ 160 °C using standard ball or thermal compression wedge bond techniques. For
DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of
shortest length, although ball bonds are also acceptable.
Biasing Note: Must apply negative bias to V
damage to amplifier.
V
GG
Figure 6. Recommended bonding diagram for pedestal mount.
Support circuitry typical of MMIC characterization fixture for CW testing.
RF
IN
0.1 µF
Visit www.macom.com for additional data sheets and product information.
100 pF
100 pF
GG
before applying positive bias to V
0.1 µF
RF
MAAPGM0034-DIE
OUT
V
DD
DD
to prevent

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